A. L. M. T. Corp.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2011-10-20

Patent Grants:

Last grant date:

2015-05-12

Top Inventors for applications by A. L. M. T. Corp.

These are the the leading inventors for applications assigned to A. L. M. T. Corp.:

Kenjiro Higaki 2 Itami, Japan
Daisuke Takagi 2 Itami, Japan
Yasushi Tsuzuki 2 Itami, Japan
Toshiya IKEDA 2 Toyama, Japan

Kouichi Takashima 2 Hyogo, Japan
Sadamu Ishidu 2 Itami, Japan
Masahiro Omachi 1 Toyama, Japan
Sadamu Ishidu 1 Itami-shi, Japan

Masahiro Omachi 1 Toyama-shi, Japan
Daisuke Takagi 1 Itami-shi, Japan
Kenjiro Higaki 1 Itami-shi, Japan
Yoshiyuki TAKAKI 1 Osaka, Japan

Masashi Narita 1 Itami, Japan
Taichiro Nishikawa 1 Osaka, Japan
Toshiya Ikeda 1 Toyama-shi, Japan
Misato KUSAKARI 1 Osaka, Japan

Isao Iwayama 1 Osaka, Japan
Akira Fukui 1 Toyama-shi, Japan
Daisuke TAKAGI 1 Hyogo, Japan
Akira Fukui 1 Toyama, Japan

Masashi Narita 1 Hyogo, Japan
Yoshihiro NAKAI 1 Osaka, Japan
Kouichi Takashima 1 Itami, Japan
Sadamu Ishidu 1 Hyogo, Japan

Kenjiro Higaki 1 Hyogo, Japan
Yasushi Tsuzuki 1 Hyogo, Japan
Yasushi Tsuzuki 1 Itami-shi, Japan
Hideaki Morigami 1 Tokyo, Japan

Recent patent applications by A. L. M. T. Corp.

A. L. M. T. Corp. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-10-20 ✅ Patent 9,028,959 granted on 2015-05-12

US20110256419A1

Chemistry; metallurgy

Composite member

#2 | 2009-03-05 ✅ Patent 8,178,893 granted on 2012-05-15

US20090057705A1

Electricity

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

#3 | 2009-01-01 ✅ Patent 7,737,562 granted on 2010-06-15

US20090001396A1

Electricity

Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

#4 | 2008-08-28 ✅ Patent 7,649,270 granted on 2010-01-19

US20080203420A1

Electricity

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

#5 | 2008-07-03 ✅ Patent 7,768,120 granted on 2010-08-03

US20080157347A1

Electricity

Heat spreader and semiconductor device using the same

#6 | 2007-11-01 ✅ Patent 8,092,914 granted on 2012-01-10

US20070252267A1

Electricity

Heat sink substrate and production method for the same

AssigneeID:

266492 ⎘