MEGIC CORPORATION

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2008-08-07

Patent Grants:

Last grant date:

2007-10-30

Top Inventors for applications by MEGIC CORPORATION

These are the the leading inventors for applications assigned to MEGIC CORPORATION:

Ching-Cheng Huang 2 Hsinchu, Taiwan
Jin-Yuan Lee 2 Hsin-Chu, Taiwan
Mou-Shiung Lin 2 Hsin-Chu, Taiwan
Mou-Shiung Lin 1 Hsinchu, Taiwan

Sehat Sutardja 1 Los Altos Hills, CA United States
Jin-Yuan Lee 1 Hsinchu, Taiwan
Albert Wu 1 Palo Alto, CA United States

Recent patent applications by MEGIC CORPORATION

MEGIC CORPORATION based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-08-07

US20080188071A1

Electricity

Low fabrication cost, fine pitch and high reliability solder bump

#2 | 2007-10-30 ✅ Patent 7,288,845 granted on 2007-10-30

US10434524

Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits

#3 | 2005-08-30 ✅ Patent 6,936,531 granted on 2005-08-30

US10690250

Process of fabricating a chip structure

AssigneeID:

267945 ⎘