COKI ENGINEERING INC

City:

Osaka-shi

Country:

Japan

Published Applications:

Last publication date:

2008-11-06

Patent Grants:

Last grant date:

Top Inventors for applications by COKI ENGINEERING INC

These are the the leading inventors for applications assigned to COKI ENGINEERING INC:

Akira Yotsutsuji 1 Osaka, Japan

Recent patent applications by COKI ENGINEERING INC

COKI ENGINEERING INC based in Osaka-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-11-06

US20080271870A1

Performing operations; transporting

Metal Mold, and Formed Body Molding Method by the Metal Mold

AssigneeID:

272551 ⎘