SEED CORPORATION

City:

MIE

Country:

Japan

Published Applications:

Last publication date:

2008-11-13

Patent Grants:

Last grant date:

2012-05-29

Top Inventors for applications by SEED CORPORATION

These are the the leading inventors for applications assigned to SEED CORPORATION:

Satoru FUKUZAWA 1 MIE, Japan
Masaaki Ohashi 1 Mie, Japan
Yukio Ohta 1 Mie, Japan
Kazuo Hirose 1 Mie, Japan

Masaki Ohashi 1 Mie, Japan

Recent patent applications by SEED CORPORATION

SEED CORPORATION based in MIE, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-11-13 ✅ Patent 8,187,404 granted on 2012-05-29

US20080276440A1

Physics

Method of making a plate-shaped peeling member

AssigneeID:

272811 ⎘