Pittsburgh, Pennsylvania
United States
23
2008-11-27
21
2008-02-05
These are the the leading inventors for applications assigned to Solid State Measurements, Inc.:
Solid State Measurements, Inc. based in Pittsburgh, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method of destructive testing the dielectric layer of a semiconductor wafer or sample
#2 | 2007-05-17 ✅ Patent 7,327,155 granted on 2008-02-05Elastic metal gate MOS transistor for surface mobility measurement in semiconductor materials
#3 | 2007-03-01 ✅ Patent 7,295,022 granted on 2007-11-13Method and system for automatically determining electrical properties of a semiconductor wafer or sample
#4 | 2006-10-05 ✅ Patent 7,282,941 granted on 2007-10-16Method of measuring semiconductor wafers with an oxide enhanced probe
#5 | 2006-05-11 ✅ Patent 7,304,490 granted on 2007-12-04In-situ wafer and probe desorption using closed loop heating
#6 | 2006-04-27 ✅ Patent 7,362,108 granted on 2008-04-22Method and system for measurement of sidewall damage in etched dielectric structures using a near field microwave probe
#7 | 2006-03-30 ✅ Patent 7,250,313 granted on 2007-07-31Method of detecting un-annealed ion implants
#8 | 2006-03-30 ✅ Patent 7,190,186 granted on 2007-03-13Method and apparatus for determining concentration of defects and/or impurities in a semiconductor wafer
#9 | 2005-12-29 ✅ Patent 7,005,307 granted on 2006-02-28Apparatus and method for detecting soft breakdown of a dielectric layer of a semiconductor wafer
#10 | 2005-12-29 ✅ Patent 7,037,734 granted on 2006-05-02Method and apparatus for determining generation lifetime of product semiconductor wafers
#11 | 2005-12-06 ✅ Patent 6,972,582 granted on 2005-12-06Apparatus and method for measuring semiconductor wafer electrical properties
#12 | 2005-11-17 ✅ Patent 7,023,231 granted on 2006-04-04Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
#13 | 2005-11-03 ✅ Patent 7,007,408 granted on 2006-03-07Method and apparatus for removing and/or preventing surface contamination of a probe
#14 | 2005-10-20 ✅ Patent 7,285,963 granted on 2007-10-23Method and system for measurement of dielectric constant of thin films using a near field microwave probe
#15 | 2005-10-13Method of testing semiconductor wafers with non-penetrating probes
#16 | 2005-07-07 ✅ Patent 7,026,837 granted on 2006-04-11Method and apparatus for determining the dielectric constant of a low permittivity dielectric on a semiconductor wafer
#17 | 2005-05-31 ✅ Patent 6,900,652 granted on 2005-05-31Flexible membrane probe and method of use thereof
#18 | 2005-05-17 ✅ Patent 6,894,519 granted on 2005-05-17Apparatus and method for determining electrical properties of a semiconductor wafer
#19 | 2005-05-05 ✅ Patent 6,991,948 granted on 2006-01-31Method of electrical characterization of a silicon-on-insulator (SOI) wafer
#20 | 2005-05-05 ✅ Patent 6,879,176 granted on 2005-04-12Conductance-voltage (GV) based method for determining leakage current in dielectrics
#21 | 2005-02-10 ✅ Patent 7,063,992 granted on 2006-06-20Semiconductor substrate surface preparation using high temperature convection heating
#22 | 2005-02-01 ✅ Patent 6,851,096 granted on 2005-02-01Method and apparatus for testing semiconductor wafers
#23 | 2005-01-11 ✅ Patent 6,842,029 granted on 2005-01-11Non-invasive electrical measurement of semiconductor wafers
273609 ⎘