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Assignee profile:

UNAXIS INTERNATIONAL TRADING LTD.

City:

Cham

Country:

Switzerland

Published Applications:

Last publication date:

2008-12-11

Patent Grants:

Last grant date:

2010-05-18

Top Inventors for applications by UNAXIS INTERNATIONAL TRADING LTD.

These are the the leading inventors for applications assigned to UNAXIS INTERNATIONAL TRADING LTD.:

Dieter Vischer 2 Zug, Switzerland
Roland Stalder 2 Zuerich, Switzerland
Roland Stalder 2 Zürich, Switzerland
Patrick Blessing 2 Thalwil, Switzerland

Daniel Schnetzler 2 Unteraegeri, Switzerland
Martina Lustenberger 2 Hagendorn, Switzerland
Marcel Niederhauser 2 Steinhausen, Switzerland
Jonathan Medding 2 Birmensdorf, Switzerland

Daniel Bolliger 1 Lucerne, Switzerland
Michael Mayer 1 Waterloo, Ontario, Canada
Stephane Balon 1 Rotkreuz, Switzerland
Ruedi Grueter 1 Buttisholz, Switzerland

Shui-Yuan Yu 1 Littau, Switzerland
Beat Bolli 1 Hunenberg, Switzerland
Martin Deflorin 1 Schoenenberg, Switzerland
Martin Deflorin 1 Oberwil bei Zug, Switzerland

Daniel Bolliger 1 Luzern, Switzerland
Jean-Baptiste Berset 1 Mueswangen, Switzerland
Pascal Menet 1 Montet, Switzerland
Heinrich Berchtold 1 Reussbuehl, Switzerland

Dominik Werne 1 Oberaegeri, Switzerland
Pascal Menet 1 Cham, Switzerland
Stefan Behler 1 Steinhausen, Switzerland
Martin Von Arx 1 Unteraegeri, Switzerland

Ladislav KUCERA 1 Thalwil, Switzerland
Martin Melzer 1 Steinhausen, Switzerland
Jean-Baptiste Berset 1 Le Bry, Switzerland

Recent patent applications by UNAXIS INTERNATIONAL TRADING LTD.

UNAXIS INTERNATIONAL TRADING LTD. based in Cham, CH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-12-11

US20080301931A1

Electricity

Method And Apparatus For Mounting Semiconductor Chips

#2 | 2007-10-04 ✅ Patent 7,719,125 granted on 2010-05-18

US20070228539A1

Electricity

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

#3 | 2007-06-28 ✅ Patent 7,597,234 granted on 2009-10-06

US20070145102A1

Electricity

Method for mounting a flip chip on a substrate

#4 | 2006-10-12 ✅ Patent 8,590,739 granted on 2013-11-26

US20060225786A1

Physics

Method for operating a pneumatic device for the metered delivery of a liquid and pneumatic device

#5 | 2006-09-28

US20060213956A1

Electricity

Method for producing a wire connection

#6 | 2006-04-13 ✅ Patent 7,353,976 granted on 2008-04-08

US20060076390A1

Performing operations; transporting

Wire bonder

#7 | 2006-04-06 ✅ Patent 7,396,005 granted on 2008-07-08

US20060071385A1

Electricity

Clamping device and transport mechanism for transporting substrates

#8 | 2006-01-05 ✅ Patent 7,415,759 granted on 2008-08-26

US20060000082A1

Electricity

Method and apparatus for mounting semiconductor chips

#9 | 2005-10-13 ✅ Patent 7,238,593 granted on 2007-07-03

US20050224965A1

Electricity

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

#10 | 2005-08-04

US20050167473A1

Electricity

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

#11 | 2005-06-23 ✅ Patent 7,184,909 granted on 2007-02-27

US20050132773A1

Electricity

Method for calibrating a bondhead

#12 | 2005-05-12 ✅ Patent 7,287,317 granted on 2007-10-30

US20050097729A1

Electricity

Apparatus for mounting semiconductor chips

#13 | 2005-03-31 ✅ Patent 7,134,589 granted on 2006-11-14

US20050067462A1

Electricity

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

#14 | 2005-03-24 ✅ Patent 7,066,373 granted on 2006-06-27

US20050061852A1

Electricity

Method for aligning the bondhead of a Die Bonder

#15 | 2005-03-17 ✅ Patent 7,193,727 granted on 2007-03-20

US20050056947A1

Electricity

Apparatus and method for mounting or wiring semiconductor chips

AssigneeID:

274146 ⎘