Quantum Leap Packaging, Inc.

City:

Wilmington, Massachusetts

Country:

United States

Published Applications:

Last publication date:

2008-12-11

Patent Grants:

Last grant date:

2007-08-07

Top Inventors for applications by Quantum Leap Packaging, Inc.

These are the the leading inventors for applications assigned to Quantum Leap Packaging, Inc.:

Michael Zimmerman 2 North Andover, MA United States
Stanford W. Crane, Jr. 1 Santa Clara, CA United States
Stanford W. Crane, JR. 1 Boca Raton, FL United States
Michael A. Zimmerman 1 North Andover, MA United States

Jacob Shverdin 1 Swampscott, MA United States
Maria M. Portuondo 1 Boca Raton, FL United States
Charley Takeshi Ogata 1 San Jose, CA United States
Myoung-soo Jeon 1 Fremont, CA United States

Keith Smith 1 Methuen, MA United States

Recent patent applications by Quantum Leap Packaging, Inc.

Quantum Leap Packaging, Inc. based in Wilmington, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-12-11

US20080305355A1

Electricity

Plastic electronic component package

#2 | 2007-08-07 ✅ Patent 7,253,365 granted on 2007-08-07

US10878000

Die package for connection to a substrate

#3 | 2005-12-20 ✅ Patent 6,977,432 granted on 2005-12-20

US10755414

Prefabricated semiconductor chip carrier

#4 | 2005-03-15 ✅ Patent 6,867,367 granted on 2005-03-15

US10767309

Package for integrated circuit die

#5 | 2005-01-20 ✅ Patent 7,053,299 granted on 2006-05-30

US20050012118A1

Electricity

Flange for integrated circuit package

AssigneeID:

274301 ⎘