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Assignee profile:

DELPHI TECHNOLOGIES, INC.

City:

Kokomo, Indiana

Country:

United States

Published Applications:

13

Last publication date:

2007-03-01

Patent Grants:

10

Last grant date:

2009-07-14

Top Inventors for applications by DELPHI TECHNOLOGIES, INC.

These are the the leading inventors for applications assigned to DELPHI TECHNOLOGIES, INC.:

Recent patent applications by DELPHI TECHNOLOGIES, INC.

DELPHI TECHNOLOGIES, INC. based in Kokomo, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-03-01
US20070045840A1
Electricity

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

 #2 | 2006-12-07 ✅ Patent 7,561,436 granted on 2009-07-14
US20060274512A1
Electricity

Circuit assembly with surface-mount IC package and heat sink

 #3 | 2006-12-07
US20060273467A1
Electricity

FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM

 #4 | 2006-08-24 ✅ Patent 7,229,855 granted on 2007-06-12
US20060189032A1
Electricity

Process for assembling a double-sided circuit component

 #5 | 2006-06-08 ✅ Patent 7,365,273 granted on 2008-04-29
US20060120058A1
Electricity

Thermal management of surface-mount circuit devices

 #6 | 2006-05-25 ✅ Patent 7,269,017 granted on 2007-09-11
US20060109632A1
Electricity

Thermal management of surface-mount circuit devices on laminate ceramic substrate

 #7 | 2006-03-23 ✅ Patent 7,294,827 granted on 2007-11-13
US20060061889A1
Electricity

Electronic module with light-blocking features

 #8 | 2005-10-27 ✅ Patent 7,321,098 granted on 2008-01-22
US20050236180A1
Electricity

Laminate ceramic circuit board and process therefor

 #9 | 2005-10-13 ✅ Patent 7,118,991 granted on 2006-10-10
US20050227400A1
Performing operations; transporting

Encapsulation wafer process

 #10 | 2005-10-06 ✅ Patent 7,064,963 granted on 2006-06-20
US20050218505A1
Electricity

Multi-substrate circuit assembly

 #11 | 2005-02-03 ✅ Patent 6,874,378 granted on 2005-04-05
US20050022616A1
Physics

Pressure transducer

 #12 | 2005-01-27 ✅ Patent 7,180,064 granted on 2007-02-20
US20050017175A1
Performing operations; transporting

Infrared sensor package

 #13 | 2005-01-27
US20050016576A1
Physics

STACKED THERMOCOUPLE STRUCTURE AND SENSING DEVICES FORMED THEREWITH
AssigneeID:

277519 ⎘