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Assignee profile:

GEM Services, Inc.

City:

Santa Clara, California

Country:

United States

Published Applications:

22

Last publication date:

2013-05-02

Patent Grants:

13

Last grant date:

2013-10-15

Top Inventors for applications by GEM Services, Inc.

These are the the leading inventors for applications assigned to GEM Services, Inc.:

Recent patent applications by GEM Services, Inc.

GEM Services, Inc. based in Santa Clara, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-05-02
US20130105974A1
Electricity

SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN METAL LAYERS

 #2 | 2013-01-17
US20130017652A1
Electricity

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

 #3 | 2013-01-10
US20130009297A1
Electricity

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

 #4 | 2013-01-10
US20130009296A1
Electricity

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

 #5 | 2012-07-19
US20120181677A1
Electricity

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

 #6 | 2012-03-08 ✅ Patent 8,558,368 granted on 2013-10-15
US20120056261A1
Electricity

Bi-directional, reverse blocking battery switch

 #7 | 2011-02-03 ✅ Patent 8,106,493 granted on 2012-01-31
US20110024886A1
Electricity

Semiconductor device package having features formed by stamping

 #8 | 2010-06-10 ✅ Patent 8,120,154 granted on 2012-02-21
US20100140762A1
Electricity

Interconnection of lead frame to die utilizing flip chip process

 #9 | 2009-11-19 ✅ Patent 8,358,017 granted on 2013-01-22
US20090283919A1
Electricity

Semiconductor package featuring flip-chip die sandwiched between metal layers

 #10 | 2009-11-05 ✅ Patent 7,691,670 granted on 2010-04-06
US20090273065A1
Electricity

Interconnection of lead frame to die utilizing flip chip process

 #11 | 2009-10-08 ✅ Patent 7,838,339 granted on 2010-11-23
US20090250796A1
Electricity

Semiconductor device package having features formed by stamping

 #12 | 2009-07-16 ✅ Patent 8,097,945 granted on 2012-01-17
US20090179265A1
Electricity

Bi-directional, reverse blocking battery switch

 #13 | 2008-09-11 ✅ Patent 7,667,309 granted on 2010-02-23
US20080217662A1
Electricity

Space-efficient package for laterally conducting device

 #14 | 2008-06-19
US20080142936A1
Electricity

Semiconductor device package diepad having features formed by electroplating

 #15 | 2008-06-12
US20080135991A1
Electricity

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

 #16 | 2008-06-03 ✅ Patent 7,382,044 granted on 2008-06-03
US11409188
-

Semiconductor device package diepad having features formed by electroplating

 #17 | 2008-05-15
US20080111219A1
Electricity

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

 #18 | 2007-06-14 ✅ Patent 7,485,498 granted on 2009-02-03
US20070134851A1
Electricity

Space-efficient package for laterally conducting device

 #19 | 2007-06-14
US20070130759A1
Electricity

Semiconductor device package leadframe formed from multiple metal layers

 #20 | 2007-05-08 ✅ Patent 7,215,012 granted on 2007-05-08
US10735585
-

Space-efficient package for laterally conducting device

 #21 | 2006-10-17 ✅ Patent 7,122,406 granted on 2006-10-17
US10751265
-

Semiconductor device package diepad having features formed by electroplating

 #22 | 2005-11-17 ✅ Patent 7,553,700 granted on 2009-06-30
US20050255634A1
Electricity

Chemical-enhanced package singulation process
AssigneeID:

2886 ⎘