Toray Engineering Co., Ltd.

City:

Osaka-shi

Country:

Japan

Published Applications:

Last publication date:

2008-03-27

Patent Grants:

Last grant date:

2011-04-05

Top Inventors for applications by Toray Engineering Co., Ltd.

These are the the leading inventors for applications assigned to Toray Engineering Co., Ltd.:

Akira Yamauchi 3 Shiga, Japan
Mikio Kawakami 2 Shiga, Japan
Minoru Nakamura 1 Tokyo, Japan
Koji ITO 1 Osaka, Japan

Masanori Akita 1 Osaka, Japan
Akira Yamauchi 1 Otsu-shi, Japan
Katsumi Terada 1 Shiga, Japan
Toshihiro Mori 1 Osaka, Japan

Takashi Hare 1 Shiga, Japan
Satoru Naraba 1 Shiga, Japan
Hiroaki Tsuruta 1 Tokyo, Japan

Recent patent applications by Toray Engineering Co., Ltd.

Toray Engineering Co., Ltd. based in Osaka-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-03-27 ✅ Patent 7,918,953 granted on 2011-04-05

US20080073027A1

Electricity

Alignment method and mounting method using the alignment method

#2 | 2007-09-11 ✅ Patent 7,267,926 granted on 2007-09-11

US10204308

Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof

#3 | 2006-03-16

US20060054283A1

Electricity

Joining apparatus

#4 | 2006-01-26 ✅ Patent 7,279,358 granted on 2007-10-09

US20060016555A1

Electricity

Mounting method and mounting device

#5 | 2005-12-15 ✅ Patent 7,299,545 granted on 2007-11-27

US20050274869A1

Electricity

Alignment method and mounting method using the alignment method

AssigneeID:

290300 ⎘