Buc
France
16
2023-04-27
15
2026-03-24
These are the the leading inventors for applications assigned to 3D PLUS:
3D PLUS based in Buc, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
INNOVATIVE PLANAR ELECTROMAGNETIC COMPONENT STRUCTURE
#2 | 2021-12-16 ✅ Patent 11,594,972 granted on 2023-02-28Resonant power converter
#3 | 2021-10-28 ✅ Patent 11,587,911 granted on 2023-02-21Process for producing a high-frequency-compatible electronic module
#4 | 2020-01-02 ✅ Patent 11,067,621 granted on 2021-07-20Apparatus for burning in electronic components
#5 | 2019-11-21 ✅ Patent 10,727,748 granted on 2020-07-28High frequency DC voltage converter of the quasi-resonant buck type
#6 | 2019-04-04 ✅ Patent 10,332,863 granted on 2019-06-25Method of miniaturized chip on chip interconnection of a 3D electronic module
#7 | 2018-06-21 ✅ Patent 10,466,097 granted on 2019-11-053D imaging optoelectronic module
#8 | 2017-12-28 ✅ Patent 9,899,250 granted on 2018-02-20Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz
#9 | 2016-12-29 ✅ Patent 10,064,278 granted on 2018-08-283D electronic module comprising a ball grid array stack
#10 | 2016-08-25 ✅ Patent 9,659,846 granted on 2017-05-23Process for manufacturing a 3D electronic module comprising external interconnection leads
#11 | 2014-11-27 ✅ Patent 9,111,688 granted on 2015-08-18Method for producing reconstituted wafers with support of the chips during their encapsulation
#12 | 2013-12-26Process For Flip-Chip Connection of an Electronic Component
#13 | 2013-07-04 ✅ Patent 8,716,036 granted on 2014-05-06Method for collective fabrication of 3D electronic modules comprising only validated PCBs
#14 | 2012-04-19 ✅ Patent 8,735,220 granted on 2014-05-27Method for positioning chips during the production of a reconstituted wafer
#15 | 2011-10-13 ✅ Patent 8,359,740 granted on 2013-01-29Process for the wafer-scale fabrication of electronic modules for surface mounting
#16 | 2007-05-24 ✅ Patent 7,635,639 granted on 2009-12-22Method for the interconnection of active and passive components and resulting thin heterogeneous component
Also check out 3D Plus' (Buc, France) applicant profile with 12 patent applications submitted.
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