OJI Interpack Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2006-03-23

Patent Grants:

Last grant date:

Top Inventors for applications by OJI Interpack Co., Ltd.

These are the the leading inventors for applications assigned to OJI Interpack Co., Ltd.:

Ilhyun Kim 1 Nottingham, United Kingdom
Kunio Cho 1 Nottingham, United Kingdom
Rick Sereno 1 North Manchester, IN United States
John Fredrick 1 Auburn Hills, MI United States

Mitsutoshi Ogata 1 Tokyo, Japan
Toshio Suzuki 1 North Manchester, IN United States

Recent patent applications by OJI Interpack Co., Ltd.

OJI Interpack Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-03-23

US20060062993A1

Performing operations; transporting

Laminated member for automobile interior ceiling material

AssigneeID:

290634 ⎘