Soldercoat Co., Ltd.

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2007-05-17

Patent Grants:

Last grant date:

2009-02-17

Top Inventors for applications by Soldercoat Co., Ltd.

These are the the leading inventors for applications assigned to Soldercoat Co., Ltd.:

Kazuhiko Tanabe 2 Kanagawa, Japan
Tetsuharu Mizutani 2 Aichi, Japan
Hiroaki Terada 2 Toyama, Japan
Takashi Tanaka 2 Osaka, Japan

Keiichiro Imamura 2 Kanagawa, Japan
Masahiro Sugiura 2 Aichi, Japan
Satoru Kobayashi 1 Komagane, Japan
Masahiro Sugiura 1 Matsuyama-shi, Japan

Kazuyuki Kato 1 Nagano, Japan
Saburo Okabe 1 Tokyo, Japan
Saburo Okabe 1 Shinagawa-ku, Japan
Masahiro Sugiura 1 Matsuyama, Japan

Satoru Kobayashi 1 Komagane-shi, Japan
Kazuyuki Kato 1 Kamiina-gun, Japan

Recent patent applications by Soldercoat Co., Ltd.

Soldercoat Co., Ltd. based in Aichi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-05-17 ✅ Patent 7,490,403 granted on 2009-02-17

US20070107214A1

Electricity

Soldering method

#2 | 2006-05-18 ✅ Patent 7,220,493 granted on 2007-05-22

US20060104854A1

Chemistry; metallurgy

Lead-free solder, and a lead-free joint

#3 | 2005-03-31 ✅ Patent 7,176,388 granted on 2007-02-13

US20050067189A1

Electricity

Soldering method and solder joint member

AssigneeID:

291959 ⎘