SUMIKA EPI SOLUTION COMPANY, LTD

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2007-07-26

Patent Grants:

Last grant date:

2009-08-18

Top Inventors for applications by SUMIKA EPI SOLUTION COMPANY, LTD

These are the the leading inventors for applications assigned to SUMIKA EPI SOLUTION COMPANY, LTD:

Noboru Fukuhara 5 Tsukuba, Japan
Hisashi Yamada 4 Tsukuba, Japan
Takenori Osada 2 Ichihara, Japan
Takayuki Inoue 2 Sodegaura, Japan

Takenori Osada 2 Chiba, Japan
Tsuyoshi NAKANO 2 Ichihara, Japan
Noboru FUKUHARA 1 Ibaraki, Japan
Takayuki Inoue 1 Sodegaura-shi, Japan

Hisashi YAMADA 1 Ibaraki, Japan
Noboru Kukuhara 1 Tsukuba, Japan

Recent patent applications by SUMIKA EPI SOLUTION COMPANY, LTD

SUMIKA EPI SOLUTION COMPANY, LTD based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-07-26 ✅ Patent 7,576,352 granted on 2009-08-18

US20070170466A1

Electricity

Method for producing compound semiconductor wafer and compound semiconductor device

#2 | 2006-11-16 ✅ Patent 7,550,786 granted on 2009-06-23

US20060255367A1

Electricity

Compound semiconductor epitaxial substrate

#3 | 2006-06-22

US20060131607A1

Electricity

Compound semiconductor device and process for producing the same

#4 | 2006-06-01 ✅ Patent 7,732,836 granted on 2010-06-08

US20060113563A1

Electricity

Compound semiconductor epitaxial substrate and method for manufacturing the same

#5 | 2006-04-13 ✅ Patent 7,291,873 granted on 2007-11-06

US20060076576A1

Electricity

High electron mobility epitaxial substrate

#6 | 2006-03-16 ✅ Patent 7,304,332 granted on 2007-12-04

US20060054923A1

Electricity

Compound semiconductor epitaxial substrate and method for manufacturing same

#7 | 2006-01-05 ✅ Patent 7,208,387 granted on 2007-04-24

US20060001044A1

Electricity

Method for manufacturing compound semiconductor wafer and compound semiconductor device

AssigneeID:

292826 ⎘