Multi Inc.

City:

Yokosuka-shi

Country:

Japan

Published Applications:

Last publication date:

2006-10-05

Patent Grants:

Last grant date:

Top Inventors for applications by Multi Inc.

These are the the leading inventors for applications assigned to Multi Inc.:

Ichiro Koiwa 1 Minato-ku, Japan
Mitsuhiro Watanabe 1 Yokosuka-shi, Japan

Recent patent applications by Multi Inc.

Multi Inc. based in Yokosuka-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-10-05

US20060223231A1

Chemistry; metallurgy

Packing method for electronic components

AssigneeID:

295755 ⎘