Assignee profile:

Leica Microsystems Inc.

City:

Depew, New York

Country:

United States

Published Applications:

4

Last publication date:

2005-11-15

Patent Grants:

4

Last grant date:

2005-11-15

Top Inventors for applications by Leica Microsystems Inc.

These are the the leading inventors for applications assigned to Leica Microsystems Inc.:

AssigneeID:

298142 ⎘