Ibi-gun
Japan
10
2009-02-12
9
2013-06-04
These are the the leading inventors for applications assigned to IBIDEN Co., Ltd.:
IBIDEN Co., Ltd. based in Ibi-gun, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Substrate with low-elasticity layer and low-thermal-expansion layer
#2 | 2007-03-22 ✅ Patent 7,361,849 granted on 2008-04-22Printed wiring board and method for manufacturing the same
#3 | 2007-03-22 ✅ Patent 7,385,146 granted on 2008-06-10Printed wiring board and method for manufacturing the same
#4 | 2007-03-15 ✅ Patent 7,585,541 granted on 2009-09-08Printed wiring board and method for manufacturing the same
#5 | 2007-03-15 ✅ Patent 7,388,159 granted on 2008-06-17Printed wiring board and method for manufacturing the same
#6 | 2007-03-08 ✅ Patent 7,712,212 granted on 2010-05-11Method for manufacturing printed wiring board
#7 | 2007-03-08 ✅ Patent 7,615,162 granted on 2009-11-10Printed wiring board and method for manufacturing the same
#8 | 2006-02-16 ✅ Patent 7,449,791 granted on 2008-11-11Printed circuit boards and method of producing the same
#9 | 2005-07-19 ✅ Patent 6,919,124 granted on 2005-07-19Ceramic substrate
#10 | 2005-01-27Ceramic substrate
298405 ⎘