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Assignee profile:

ESEC Trading SA

City:

Cham

Country:

Switzerland

Published Applications:

Last publication date:

2007-10-23

Patent Grants:

Last grant date:

2007-10-23

Top Inventors for applications by ESEC Trading SA

These are the the leading inventors for applications assigned to ESEC Trading SA:

Jonathan Medding 3 Birmensdorf, Switzerland
Silvan Thuerlemann 2 Unteraegeri, Switzerland
Dieter Vischer 2 Zug, Switzerland
Michael Mayer 2 Neuheim, Switzerland

Eugen Mannhart 2 Cham, Switzerland
Dominik Hartmann 2 Hagendorn, Switzerland
Ruedi Grueter 1 Neuenkirch, Switzerland
Markus Michler 1 Feldkirch, Austria

Jürg Schwizer 1 Pfaffnau, Switzerland
Peter Hess 1 Walchwil, Switzerland
Reto Schubiger 1 Ebikon, Switzerland
Peter Hess 1 Menzingen, Switzerland

Roland Adorni 1 Cham, Switzerland
Thomas Günther 1 Thalwil, Switzerland
Tsing Dschen 1 Dietikon, Switzerland
Felix Leu 1 Zug, Switzerland

Raphael Bernhardsgruetter 1 St. Gallen, Switzerland
Matthias Krieger 1 Cham, Switzerland
Nicolino Onda 1 Bad Raguz, Switzerland
Hansjörg Gujer 1 Steinhausen, Switzerland

Christof Koster 1 Allenwinden, Switzerland
Alexander Greber 1 Eich, Switzerland
Nicolino Onda 1 Bad Ragaz, Switzerland
Martin Melzer 1 Steinhausen, Switzerland

Recent patent applications by ESEC Trading SA

ESEC Trading SA based in Cham, CH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-10-23 ✅ Patent 7,284,318 granted on 2007-10-23

US10313183

Apparatus for mounting semiconductor chips

#2 | 2007-01-09 ✅ Patent 7,159,751 granted on 2007-01-09

US10853328

Wire bonder

#3 | 2006-10-17 ✅ Patent 7,120,995 granted on 2006-10-17

US10861720

Apparatus for mounting semiconductors

#4 | 2006-09-19 ✅ Patent 7,108,167 granted on 2006-09-19

US10819652

Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method

#5 | 2006-07-25 ✅ Patent 7,080,771 granted on 2006-07-25

US10863303

Method for checking the quality of a wedge bond

#6 | 2006-04-04 ✅ Patent 7,020,954 granted on 2006-04-04

US10086405

Apparatus for placing a semiconductor chip as a flipchip on a substrate

#7 | 2006-02-28 ✅ Patent 7,004,372 granted on 2006-02-28

US10686752

Method for determining optimum bond parameters when bonding with a wire bonder

#8 | 2006-02-07 ✅ Patent 6,993,986 granted on 2006-02-07

US10606146

Clamping element with an integrated force sensor

#9 | 2005-08-30 ✅ Patent 6,935,539 granted on 2005-08-30

US10723685

Device for the metered delivery of a viscous liquid

#10 | 2005-08-23 ✅ Patent 6,931,932 granted on 2005-08-23

US10742176

Device for measuring the amplitude of the tip of an oscillating capillary

#11 | 2005-08-16 ✅ Patent 6,929,168 granted on 2005-08-16

US10357023

Method for determining optimum bonding parameters for bonding with a wire bonder

#12 | 2005-05-24 ✅ Patent 6,898,481 granted on 2005-05-24

US10389722

Apparatus for mounting semiconductor chips

#13 | 2005-02-22 ✅ Patent 6,857,554 granted on 2005-02-22

US10391410

Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder

#14 | 2005-02-10

US20050029328A1

Electricity

Method for checking the quality of a wedge bond

#15 | 2005-01-20 ✅ Patent 7,146,718 granted on 2006-12-12

US20050011067A1

Electricity

Apparatus for mounting semiconductors

#16 | 2005-01-11 ✅ Patent 6,839,958 granted on 2005-01-11

US9951832

Apparatus for mounting semiconductor chips

AssigneeID:

298731 ⎘