Wentworth Mold Inc.

City:

Hamilton

Country:

Canada

Published Applications:

Last publication date:

2005-09-27

Patent Grants:

Last grant date:

2005-09-27

Top Inventors for applications by Wentworth Mold Inc.

These are the the leading inventors for applications assigned to Wentworth Mold Inc.:

Tar Tsau 4 Burlington, Canada
Kyi San Kyi 3 Burlington, Canada
Reinhold Ernst Nitsche 3 Caledonia, Canada

Recent patent applications by Wentworth Mold Inc.

Wentworth Mold Inc. based in Hamilton, CA has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2005-09-27 ✅ Patent 6,948,924 granted on 2005-09-27

US10411339

Mold assembly with modular mold shells

#2 | 2005-07-05 ✅ Patent 6,913,455 granted on 2005-07-05

US10411177

Hot fill mold shell assembly with reduced heat transfer

#3 | 2005-06-30 ✅ Patent 6,994,542 granted on 2006-02-07

US20050142243A1

Performing operations; transporting

Air flow compensation for mold carrier

#4 | 2005-03-03 ✅ Patent 7,025,584 granted on 2006-04-11

US20050048155A1

Performing operations; transporting

Mold base assembly

AssigneeID:

299237 ⎘