Assignee profile:

Leica Microsystems Inc.

City:

Buffalo, New York

Country:

United States

Published Applications:

4

Last publication date:

2005-07-05

Patent Grants:

3

Last grant date:

2005-07-05

Top Inventors for applications by Leica Microsystems Inc.

These are the the leading inventors for applications assigned to Leica Microsystems Inc.:

AssigneeID:

300893 ⎘