E-Pack Ventures Sdn. Bhd.

City:

Ampang

Country:

Malaysia

Published Applications:

Last publication date:

2005-08-11

Patent Grants:

Last grant date:

Top Inventors for applications by E-Pack Ventures Sdn. Bhd.

These are the the leading inventors for applications assigned to E-Pack Ventures Sdn. Bhd.:

Mew Sang Yap 1 Ampang, Malaysia
Luck Wun Ng 1 Kuala Lumpur, Malaysia

Recent patent applications by E-Pack Ventures Sdn. Bhd.

E-Pack Ventures Sdn. Bhd. based in Ampang, MY has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2005-08-11

US20050172867A1

Performing operations; transporting

Light weight expendable metal pallet

AssigneeID:

302738 ⎘