Wen-Kun Yang

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2006-05-04

Patent Grants:

Last grant date:

2007-03-27

Top Inventors for applications by Wen-Kun Yang

These are the the leading inventors for applications assigned to Wen-Kun Yang:

Wen-Pin Yang 3 Hsinchu, Taiwan
Shih-Li Chen 3 Jhudong Township, Hsinchu County, Taiwan
Wen Kun Yang 3 Hsinchu, Taiwan
Shih-Li Chen 2 Jhudong Township, Taiwan

Shih-Li Chen 1 Hsinchu County, Taiwan

Recent patent applications by Wen-Kun Yang

Wen-Kun Yang based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-05-04 ✅ Patent 7,196,408 granted on 2007-03-27

US20060091514A1

Electricity

Fan out type wafer level package structure and method of the same

#2 | 2005-10-27 ✅ Patent 7,262,081 granted on 2007-08-28

US20050236696A1

Electricity

Fan out type wafer level package structure and method of the same

#3 | 2005-06-09 ✅ Patent 7,459,781 granted on 2008-12-02

US20050124093A1

Electricity

Fan out type wafer level package structure and method of the same

AssigneeID:

304485 ⎘