SEIDENSHA ELECTRONICS CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2021-05-27

Patent Grants:

Last grant date:

2022-01-04

Top Inventors for applications by SEIDENSHA ELECTRONICS CO., LTD.

These are the the leading inventors for applications assigned to SEIDENSHA ELECTRONICS CO., LTD.:

Noriaki MATSUGISHI 2 Tokyo, Japan
Noriaki MATSUGISHI 1 Arakawa-ku, Tokyo, Japan
Kimihiko Watanabe 1 Tokyo, Japan
Naokazu Nagasawa 1 Tokyo, Japan

Tadahiro Konita 1 Tokyo, Japan
Shigemasa Tsubone 1 Tokyo, Japan
Naokazu NAGASAWA 1 Arakawa-ku, Tokyo, Japan
Kumihiko WATANABE 1 Arakawa-ku, Tokyo, Japan

Shigeru OGAYA 1 Tokyo, Japan
Shigemasa TSUBONE 1 Arakawa-ku, Tokyo, Japan

Recent patent applications by SEIDENSHA ELECTRONICS CO., LTD.

SEIDENSHA ELECTRONICS CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-05-27 ✅ Patent 11,214,012 granted on 2022-01-04

US20210154944A1

Performing operations; transporting

Ultrasonic welding method, structure welded by ultrasonic welding method, and ultrasonic welding device

#2 | 2018-04-26 ✅ Patent 10,286,608 granted on 2019-05-14

US20180111327A1

Performing operations; transporting

Laser welding apparatus and laser welding method

#3 | 2017-07-20 ✅ Patent 10,343,341 granted on 2019-07-09

US20170203499A1

Performing operations; transporting

Thermal caulking device

#4 | 2014-11-06 ✅ Patent 9,108,362 granted on 2015-08-18

US20140326411A1

Performing operations; transporting

Welding device and method for welding thermoplastic resin articles, and pressing unit for the welding device

Also check out SEIDENSHA ELECTRONICS CO., LTD.'s (Tokyo, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

310858 ⎘