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Assignee profile:

EPIC TECHNOLOGIES, INC.

City:

Woburn, Massachusetts

Country:

United States

Published Applications:

13

Last publication date:

2013-07-25

Patent Grants:

12

Last grant date:

2012-05-01

Top Inventors for applications by EPIC TECHNOLOGIES, INC.

These are the the leading inventors for applications assigned to EPIC TECHNOLOGIES, INC.:

Recent patent applications by EPIC TECHNOLOGIES, INC.

EPIC TECHNOLOGIES, INC. based in Woburn, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-07-25
US20130185935A1
Electricity

METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE

 #2 | 2011-06-23 ✅ Patent 8,169,065 granted on 2012-05-01
US20110147911A1
Electricity

Stackable circuit structures and methods of fabrication thereof

 #3 | 2010-02-25 ✅ Patent 8,324,020 granted on 2012-12-04
US20100047970A1
Electricity

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

 #4 | 2010-02-25 ✅ Patent 8,564,119 granted on 2013-10-22
US20100044855A1
Electricity

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

 #5 | 2010-02-11 ✅ Patent 8,590,145 granted on 2013-11-26
US20100035384A1
Electricity

Method of fabricating a circuit structure

 #6 | 2010-02-11 ✅ Patent 8,533,941 granted on 2013-09-17
US20100032091A1
Electricity

Method of bonding two structures together with an adhesive line of controlled thickness

 #7 | 2010-02-11 ✅ Patent 8,474,133 granted on 2013-07-02
US20100031500A1
Electricity

Method of fabricating a base layer circuit structure

 #8 | 2008-12-25 ✅ Patent 7,619,901 granted on 2009-11-17
US20080316714A1
Electricity

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

 #9 | 2008-12-25 ✅ Patent 7,830,000 granted on 2010-11-09
US20080315404A1
Electricity

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

 #10 | 2008-12-25 ✅ Patent 7,868,445 granted on 2011-01-11
US20080315391A1
Electricity

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

 #11 | 2008-12-25 ✅ Patent 7,863,090 granted on 2011-01-04
US20080315377A1
Electricity

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

 #12 | 2008-12-25 ✅ Patent 8,384,199 granted on 2013-02-26
US20080315375A1
Electricity

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

 #13 | 2005-07-21 ✅ Patent 7,112,467 granted on 2006-09-26
US20050158009A1
Electricity

Structure and method for temporarily holding integrated circuit chips in accurate alignment
AssigneeID:

31138 ⎘