Powertech Technology Inc.

City:

Hukou

Country:

Taiwan

Published Applications:

Last publication date:

2026-02-26

Patent Grants:

Last grant date:

2025-11-18

Top Inventors for applications by Powertech Technology Inc.

These are the the leading inventors for applications assigned to Powertech Technology Inc.:

Kun-Yung HUANG 2 Hukou, Taiwan
Jen-I HUANG 2 Hukou, Taiwan
Ting-Yeh WU 1 Hukou, Taiwan
Kun-Chi HSU 1 Hukou, Taiwan

Yi-Kai FU 1 Hukou, Taiwan
Ching-Chao LIN 1 Hukou, Taiwan
Chin-Ta WU 1 Hukou, Taiwan
Ying-Lin CHEN 1 Hukou, Taiwan

Sheng-Tou TSENG 1 Hukou, Taiwan
Shih-Chun CHEN 1 Hukou, Taiwan

Recent patent applications by Powertech Technology Inc.

Powertech Technology Inc. based in Hukou, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-02-26

US20260060147A1

Electricity

SEMICONDUCTOR PACKAGE COMPONENT AND METHOD OF MAKING THE SAME

#2 | 2025-11-27

US20250364487A1

Electricity

THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE COMPONENT AND METHOD FOR MAKING THE SAME

#3 | 2023-12-21 ✅ Patent 12,477,849 granted on 2025-11-18

US20230411419A1

Electricity

FAN-OUT PACKAGE STRUCTURE OF IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF

#4 | 2023-07-13 ✅ Patent 12,557,692 granted on 2026-02-17

US20230223311A1

Electricity

SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE

#5 | 2021-07-15 ✅ Patent 11,587,808 granted on 2023-02-21

US20210217641A1

Electricity

Chip carrier device

AssigneeID:

312850 ⎘