Suwon-si
South Korea
98,736
2026-10-08
77,226
2026-10-06
Samsung Electronics is a multinational electronics company headquartered in Suwon, South Korea. Founded in 1969 as a subsidiary of the Samsung Group, it has grown into one of the world's leading manufacturers of consumer electronics, semiconductors, and telecommunications equipment.
Samsung Electronics boasts a vast and diverse patent portfolio. Their patents cover a wide array of technologies, including mobile devices, displays, memory technology, semiconductor manufacturing, home appliances, and telecommunications infrastructure. Samsung's commitment to research and development has led to groundbreaking advancements in areas such as flexible displays, energy-efficient memory chips, and 5G communication technologies.
These are the the leading inventors for applications assigned to SAMSUNG ELECTRONICS CO., LTD.:
SAMSUNG ELECTRONICS CO., LTD. based in Suwon-si, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
SEMICONDUCTOR PACKAGE
#2 | 2026-10-08SEMICONDUCTOR DEVICE WITH REDUCED WARPAGE
#3 | 2026-10-08SEMICONDUCTOR PACKAGE INCLUDING CONNECTION BUMP
#4 | 2026-10-08SEMICONDUCTOR PACKAGE
#5 | 2026-10-08SEMICONDUCTOR PACKAGE INCLUDING CONNECTING PADS
#6 | 2026-10-08SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
#7 | 2026-10-08SEMICONDUCTOR DEVICE INCLUDING CHARGE SHIELDING LAYER
#8 | 2026-10-08SEMICONDUCTOR PACKAGE INCLUDING SHIELDING LAYER AND BARRIER PATTERN
#9 | 2026-10-08SEMICONDUCTOR PACKAGE WITH STRESS-RELIEF STRUCTURES
#10 | 2026-10-08SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#11 | 2026-10-08SEMICONDUCTOR PACKAGE WITH STACKED MEMBERS
#12 | 2026-10-08SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF
#13 | 2026-10-08SEMICONDUCTOR PACKAGE
#14 | 2026-10-08SEMICONDUCTOR DEVICES HAVING THROUGH-INSULATING STRUCTURES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
#15 | 2026-10-08SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#16 | 2026-10-08SEMICONDUCTOR DEVICES HAVING CRACK DETECTION STRUCTURE
#17 | 2026-10-08AUXILIARY RING IN SUBSTRATE PROCESSING APPARATUS
#18 | 2026-10-08SUBSTRATE MARKING APPARATUS AND SUBSTRATE MARKING METHOD USING THE SAME
#19 | 2026-10-08METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING HEAT TREATMENT APPARATUS
#20 | 2026-10-08COMPOSITION FOR WET ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE COMPOSITION
#21 | 2026-10-08METHOD AND APPARATUS WITH SUPERCONDUCTING QUANTUM CHIP
#22 | 2026-10-08DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
#23 | 2026-10-08LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS INCLUDING THE SAME
#24 | 2026-10-08IMAGE SENSOR
#25 | 2026-10-08IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE IMAGE SENSOR
#26 | 2026-10-08SEMICONDUCTOR DEVICE INCLUDING CUTTING PATTERN
#27 | 2026-10-08SEMICONDUCTOR DEVICE
#28 | 2026-10-08INTEGRATED CIRCUIT DEVICE
#29 | 2026-10-08SEMICONDUCTOR DEVICES
#30 | 2026-10-08INTEGRATED CIRCUIT DEVICE
#31 | 2026-10-08SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE LAYERS AND CELL CAPACITOR
#32 | 2026-10-08SEMICONDUCTOR DEVICE INCLUDING CHANNEL LAYER
#33 | 2026-10-08INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#34 | 2026-10-08SEMICONDUCTOR MEMORY DEVICE
#35 | 2026-10-08SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC MATERIAL FILM AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
#36 | 2026-10-08SEMICONDUCTOR DEVICES INCLUDING GUARD RING STRUCTURE AND DATA STORAGE SYSTEMS INCLUDING THE SAME
#37 | 2026-10-08SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME
#38 | 2026-10-08SEMICONDUCTOR DEVICE WITH THROUGH ELECTRODE THROUGH MOLD STRUCTURE
#39 | 2026-10-08SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#40 | 2026-10-08SEMICONDUCTOR MEMORY DEVICE
#41 | 2026-10-08SEMICONDUCTOR DEVICE INCLUDING CAPACITORS, WORD LINE PADS AND WORD LINE CONTACTS
#42 | 2026-10-08SEMICONDUCTOR DEVICES INCLUDING GLOBAL BITLINES
#43 | 2026-10-08CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
#44 | 2026-10-08SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#45 | 2026-10-08ELECTRONIC DEVICE INCLUDING VAPOR CHAMBER
#46 | 2026-10-08DEVICE AND METHOD FOR WIRELESS COMMUNICATION
#47 | 2026-10-08METHOD AND DEVICE FOR TRAINING AND INFERENCE BASED ON GENERATIVE NEURAL NETWORK IN WIRELESS COMMUNICATION SYSTEM
#48 | 2026-10-08METHOD OF OPERATING IMAGE SENSOR AND IMAGE SENSOR PERFORMING THE SAME
#49 | 2026-10-08IMAGE SENSOR INCLUDING AVALANCHE PHOTODIODE
#50 | 2026-10-08CIS DR IMAGE SENSOR WITH LINEAR OUTPUT COMPRESSED PROCESSING AND AF HANDLING
#51 | 2026-10-08METHOD AND SERVER FOR PROVIDING MEDIA CONTENT
#52 | 2026-10-08SOURCE DEVICE, DISPLAY DEVICE, AND OPERATING METHOD OF SOURCE DEVICE
#53 | 2026-10-08ENCODING METHOD AND DEVICE, AND DECODING METHOD AND DEVICE
#54 | 2026-10-08METHOD AND APPARATUS FOR VERIFYING FIRMWARE
#55 | 2026-10-08METHOD AND APPARATUS FOR ALLOCATING MASKING PATTERN OF POLAR CODES TO PREVENT FALSE ALARM IN WIRELESS COMMUNICATION SYSTEM
#56 | 2026-10-08LOW GATE-COUNT HARDWARE ARCHITECTURE FOR LIST-DECODING OF POLAR CODE
#57 | 2026-10-08ELECTRONIC DEVICE PERFORMING RF CALIBRATION AND COMPUTING SYSTEM INCLUDING THE SAME
#58 | 2026-10-08LOCK DETECTOR INCLUDING DIGITAL CALIBRATION
#59 | 2026-10-08WEARABLE ELECTRONIC DEVICE INCLUDING CONDUCTIVE PATTERN
#60 | 2026-10-08SIGNAL TRANSMISSION STRUCTURE FOR SIGNAL TRANSMISSION IN MULTI-LAYER CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
#61 | 2026-10-08MEMORY SYSTEM, MEMORY CONTROLLER, AND METHOD OF OPERATING MEMORY CONTROLLER WITH TRAINING CIRCUIT
#62 | 2026-10-08MEMORY DEVICE AND METHOD OF OPERATION THEREOF
#63 | 2026-10-08MEMORY DEVICE INCLUDING BIT LINE SENSE AMPLIFIER AND OPERATING METHOD THEREOF
#64 | 2026-10-08PERIPHERAL CIRCUIT AND MEMORY DEVICE INCLUDING THE SAME
#65 | 2026-10-08ELECTRONIC APPARATUS AND CONTROL METHOD THEREOF
#66 | 2026-10-08METHOD AND DEVICE WITH RESTORATION OF THREE-DIMENSIONAL POINT MAP FROM MONOCULAR IMAGE
#67 | 2026-10-08ELECTRONIC DEVICE AND OPERATION METHOD OF THE ELECTRONIC DEVICE
#68 | 2026-10-08ELECTRONIC APPARATUS AND METHOD FOR CONTROLLING THE SAME
#69 | 2026-10-08METHOD AND SYSTEM FOR GENERATING TEST SCENARIOS USING ARTIFICIAL INTELLIGENCE MODELS
#70 | 2026-10-08SELF TUNING FOR DE-NOISING USING MULTIPLE THRESHOLD-EXPERT MACHINE LEARNING MODELS
#71 | 2026-10-08METHOD AND APPARATUS FOR REPRESENTING DATA
#72 | 2026-10-08NONVOLATILE MEMORY DEVICE INCLUDING INPUT/OUTPUT PAD, STORAGE SYSTEM COMPRISING NONVOLATILE MEMORY DEVICE, AND METHOD OF OPERATING NONVOLATILE MEMORY DEVICE
#73 | 2026-10-08METHOD FOR GENERATING SPACE MAP INCLUDING ACTUAL IMAGE BY USING IMAGE OBTAINED BY PHOTOGRAPHING SPACE, AND ELECTRONIC DEVICE FOR PERFORMING SAME
#74 | 2026-10-08LIGHT DIFFUSING FILM, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS COMPRISING SAME
#75 | 2026-10-08METHOD FOR PREDICTING DEFECT IN SEMICONDUCTOR DEVICE
#76 | 2026-10-08SUBSTRATE INSPECTION APPARATUS
#77 | 2026-10-08DARK FIELD DEFECT INSPECTION SYSTEM AND INSPECTION METHOD THEREOF
#78 | 2026-10-08WASHING MACHINE
#79 | 2026-10-08SEMICONDUCTOR PROCESS SYSTEM AND METHOD OF CLEANING THE SAME
#80 | 2026-10-01SEMICONDUCTOR PACKAGE
#81 | 2026-10-01SEMICONDUCTOR PACKAGE
#82 | 2026-10-01MULTI-CHIP STACKING METHOD
#83 | 2026-10-01SEMICONDUCTOR PACKAGE WITH ALIGNMENT MARKS
#84 | 2026-10-01SEMICONDUCTOR PACKAGE
#85 | 2026-10-01SEMICONDUCTOR PACKAGES HAVING CAPACITORS
#86 | 2026-10-01SEMICONDUCTOR DEVICE INCLUDING METAL WIRING LAYER
#87 | 2026-10-01SEMICONDUCTOR DEVICE
#88 | 2026-10-01SEMICONDUCTOR DEVICE INCLUDING VIA
#89 | 2026-10-01METHOD OF FORMING PATTERN AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#90 | 2026-10-01PIXEL ARRAY OF IMAGE SENSOR
#91 | 2026-10-01IMAGE SENSOR INCLUDING FLOATING DIFFUSION REGION
#92 | 2026-10-01IMAGE SENSOR
#93 | 2026-10-01IMAGE SENSOR INCLUDING A PLURALITY OF PIXELS AND AT LEAST ONE LENS
#94 | 2026-10-01IMAGE SENSOR
#95 | 2026-10-01INTEGRATED CIRCUIT DEVICE
#96 | 2026-10-01INTEGRATED CIRCUIT DEVICE
#97 | 2026-10-01SEMICONDUCTOR DEVICE INCLUDING A BURIED PATTERN
#98 | 2026-10-01SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN AND INSULATION STRUCTURE
#99 | 2026-10-01SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#100 | 2026-10-01SEMICONDUCTOR DEVICES INCLUDING CENTRAL INSULATING LAYER
Also check out SAMSUNG ELECTRONICS CO., LTD.'s (Suwon-si, South Korea) applicant profile with 62,108 patent applications submitted.
313 ⎘