BEIJING SAI TECHNOLOGY CO., LTD.

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2021-07-22

Patent Grants:

Last grant date:

2023-04-18

Top Inventors for applications by BEIJING SAI TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to BEIJING SAI TECHNOLOGY CO., LTD.:

Risheng LI 1 Beijing, China
Liedong WANG 1 Beijing, China
YUNFENG LIU 1 Beijing, China

Recent patent applications by BEIJING SAI TECHNOLOGY CO., LTD.

BEIJING SAI TECHNOLOGY CO., LTD. based in Beijing, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-07-22 ✅ Patent 11,632,879 granted on 2023-04-18

US20210227724A1

Electricity

Heat dissipation plate for chip heat dissipation, server heat dissipation system, and heating device

AssigneeID:

313159 ⎘