Assignee profile:

ADVANCED INQUIRY SYSTEMS, INC.

City:

Beaverton, Oregon

Country:

United States

Published Applications:

11

Last publication date:

2014-07-17

Patent Grants:

10

Last grant date:

2015-11-03

Top Inventors for applications by ADVANCED INQUIRY SYSTEMS, INC.

These are the the leading inventors for applications assigned to ADVANCED INQUIRY SYSTEMS, INC.:

Recent patent applications by ADVANCED INQUIRY SYSTEMS, INC.

ADVANCED INQUIRY SYSTEMS, INC. based in Beaverton, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-07-17 ✅ Patent 9,176,186 granted on 2015-11-03
US20140197858A1
Physics

Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed

#2 | 2014-06-26 ✅ Patent 9,494,618 granted on 2016-11-15
US20140179031A1
Electricity

Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods

#3 | 2014-06-26
US20140176174A1
Physics

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

#4 | 2013-12-19 ✅ Patent 8,697,456 granted on 2014-04-15
US20130337587A1
Electricity

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

#5 | 2013-11-28 ✅ Patent 8,872,533 granted on 2014-10-28
US20130314115A1
Physics

Wafer testing system and associated methods of use and manufacture

#6 | 2013-10-10 ✅ Patent 8,779,789 granted on 2014-07-15
US20130265071A1
Physics

Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods

#7 | 2013-07-25 ✅ Patent 9,146,269 granted on 2015-09-29
US20130187675A1
Physics

Maintaining a wafer/wafer translator pair in an attached state free of a gasket diposed

#8 | 2012-06-21 ✅ Patent 8,476,630 granted on 2013-07-02
US20120156811A1
Electricity

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

#9 | 2012-06-14 ✅ Patent 8,461,024 granted on 2013-06-11
US20120149134A1
Physics

Methods and apparatus for thinning, testing and singulating a semiconductor wafer

#10 | 2012-03-29 ✅ Patent 8,405,414 granted on 2013-03-26
US20120074976A1
Physics

Wafer testing systems and associated methods of use and manufacture

#11 | 2011-03-03 ✅ Patent 8,362,797 granted on 2013-01-29
US20110050274A1
Physics

Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween

Also check out Advanced Inquiry Systems, Inc.'s (Beaverton, United States) applicant profile with 4 patent applications submitted.

AssigneeID:

31421 ⎘