VISHAY GENERAL SEMICONDUCTOR, LLC

City:

Malvern, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2025-06-19

Patent Grants:

Last grant date:

2024-01-16

Top Inventors for applications by VISHAY GENERAL SEMICONDUCTOR, LLC

These are the the leading inventors for applications assigned to VISHAY GENERAL SEMICONDUCTOR, LLC:

Huiying DING 5 Tianjin, China
Longnan JIN 5 Tianjin, China
Junfeng LIU 4 Tianjin, China
Thomas SCHMIDT 4 Leonding, Austria

Heinrich Karrer 4 Regau, Austria
Ming-Tai Chiang 1 Taipei, Taiwan
Chun-Ta LEE 1 Taipei, Taiwan
Junkai BAI 1 Tianjin, China

Jui Sen CHEN 1 New Taipei City, Taiwan
Wan-Lan Chiang 1 Taipei, Taiwan

Recent patent applications by VISHAY GENERAL SEMICONDUCTOR, LLC

VISHAY GENERAL SEMICONDUCTOR, LLC based in Malvern, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-06-19

US20250201653A1

Electricity

ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTRICAL COMPONENTS

#2 | 2025-02-13

US20250054827A1

Electricity

STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION

#3 | 2023-01-19 ✅ Patent 11,876,003 granted on 2024-01-16

US20230019610A1

Electricity

Semiconductor package and packaging process for side-wall plating with a conductive film

#4 | 2022-10-06 ✅ Patent 11,764,075 granted on 2023-09-19

US20220319869A1

Electricity

Package assembly for plating with selective molding

#5 | 2021-12-02 ✅ Patent 11,393,699 granted on 2022-07-19

US20210375641A1

Electricity

Packaging process for plating with selective molding

#6 | 2021-11-25 ✅ Patent 11,450,534 granted on 2022-09-20

US20210366729A1

Electricity

Packaging process for side-wall plating with a conductive film

Also check out VISHAY GENERAL SEMICONDUCTOR, LLC's (Malvern, United States) applicant profile with 6 patent applications submitted.

AssigneeID:

317721 ⎘