Des Plaines, Illinois
United States
6
2023-06-15
6
2023-12-26
These are the the leading inventors for applications assigned to Mespack Cloud, LLC:
Mespack Cloud, LLC based in Des Plaines, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Machine for cutting pouches with shaped perimeter edge, and method
#2 | 2022-01-06 ✅ Patent 11,858,671 granted on 2024-01-02Pouch forming mold configuration, and method
#3 | 2021-08-26 ✅ Patent 11,440,692 granted on 2022-09-13Patterned cut pouch forming machine, and method
#4 | 2021-07-01 ✅ Patent 11,590,673 granted on 2023-02-28Machine for cutting pouches with shaped perimeter edge, and method
#5 | 2020-10-22 ✅ Patent 11,148,837 granted on 2021-10-19Pouch forming mold configuration, and method
#6 | 2019-11-28 ✅ Patent 11,273,570 granted on 2022-03-15Pouch registration monitoring and control system
Also check out Mespack Cloud, LLC's (Des Plaines, United States) applicant profile with 6 patent applications submitted.
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