IHI INFRASTRUCTURE SYSTEMS CO., LTD.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2026-02-05

Patent Grants:

Last grant date:

2025-11-04

Top Inventors for applications by IHI INFRASTRUCTURE SYSTEMS CO., LTD.

These are the the leading inventors for applications assigned to IHI INFRASTRUCTURE SYSTEMS CO., LTD.:

Koutarou Inose 3 Tokyo, Japan
Yoshihiko Nakamura 3 Osaka, Japan
Shinya OSAWA 2 Osaka, Japan
Akira Katou 2 Tokyo, Japan

Naoyuki MATSUMOTO 2 Tokyo, Japan
Junko Yamada 2 Tokyo, Japan
Daiki OKITA 2 Tokyo, Japan
Seiji OKADA 1 Osaka, Japan

Satoshi Kawabata 1 Osaka, Japan
Shinya Osawa 1 Sakai, Japan
Kunio Yonekura 1 Osaka, Japan
Takahiro Yamagami 1 Osaka, Japan

Kazuya Ueda 1 Osaka, Japan
Akihiro Yamanouchi 1 Osaka, Japan
Yuji Takeda 1 Osaka, Japan
Masashi Yabuno 1 Osaka, Japan

Hiroaki HATANAKA 1 Tokyo, Japan
Yoshihiko Nakamura 1 Sakai, Japan
Arisa Yanagihara 1 Tokyo, Japan
Hiroki KAWAI 1 Tokyo, Japan

Recent patent applications by IHI INFRASTRUCTURE SYSTEMS CO., LTD.

IHI INFRASTRUCTURE SYSTEMS CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-02-05

US20260034610A1

Performing operations; transporting

REPAIRING LASER WELDING METHOD AND REPAIRING LASER WELDING DEVICE

#2 | 2022-04-21 ✅ Patent 12,459,057 granted on 2025-11-04

US20220118552A1

Performing operations; transporting

REPAIRING LASER WELDING METHOD AND REPAIRING LASER WELDING DEVICE

#3 | 2015-10-22 ✅ Patent 9,612,226 granted on 2017-04-04

US20150300992A1

Physics

Method for measuring height of lack of penetration and ultrasonic flaw detector

#4 | 2015-02-26 ✅ Patent 9,021,644 granted on 2015-05-05

US20150052694A1

Fixed constructions

Method for replacing sloped cables, and temporary hanger for replacing sloped cables

#5 | 2015-02-19 ✅ Patent 9,623,508 granted on 2017-04-18

US20150048055A1

Performing operations; transporting

Welding method

Also check out IHI Infrastructure Systems Co., Ltd.'s (Osaka, Japan) applicant profile with 4 patent applications submitted.

AssigneeID:

322716 ⎘