COVINGTON, Georgia
United States
70
2026-05-28
14
2024-07-02
These are the the leading inventors for applications assigned to ABSOLICS INC.:
ABSOLICS INC. based in COVINGTON, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
GLASS CORE FOR PACKAGING AND METHOD OF MANUFACTURING GLASS CORE FOR PACKAGING
#2 | 2026-05-21METHOD OF MANUFACTURING PACKAGING SUBSTRATE
#3 | 2026-05-07AUTOMATIC CARRIER SLOT SCANNING APPARATUS FOR GLASS SUBSTRATE SEMICONDUCTOR PACKAGE
#4 | 2026-04-30PACKAGING SUBSTRATE
#5 | 2026-04-30SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
#6 | 2026-04-30SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
#7 | 2026-04-30PACKAGING SUBSTRATE
#8 | 2026-04-30PACKAGING SUBSTRATE
#9 | 2026-04-30PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
#10 | 2026-04-30PACKAGING SUBSTRATE
#11 | 2026-04-23METHOD OF PRE-ADJUSTING GLASS SUBSTRATE FOR MANUFACTURING GLASS SUBSTRATE SEMICONDUCTOR PACKAGE
#12 | 2026-04-16MANUFACTURE METHOD FOR A PACKAGING SUBSTRATE
#13 | 2026-04-02PACKAGING SUBSTRATE HAVING EMBEDDED BRIDGE AND MANUFACTURING METHOD OF THE SAME
#14 | 2026-04-02MANUFACTURE METHOD FOR A PACKAGING SUBSTRATE
#15 | 2026-03-12PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF
#16 | 2026-02-19PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#17 | 2026-01-22MANUFACTURING METHOD FOR PACKAGING SUBSTRATE
#18 | 2026-01-01PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING SAME
#19 | 2026-01-01SUBSTRATE LOADING CASSETTE
#20 | 2025-07-03MANUFACTURING METHOD FOR PACKAGING SUBSTRATE
#21 | 2025-07-03METHOD OF MANUFACTURING SUBSTRATE INCLUDING PACKAGING SUBSTRATE
#22 | 2025-06-26PLATE SHAPED SUBSTRATE AND PACKAGING SUBSTRATE
#23 | 2025-06-26PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF
#24 | 2025-06-05PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
#25 | 2025-06-05MANUFACTURING METHOD FOR A PACKAGING SUBSTRATE
#26 | 2025-05-29PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
#27 | 2025-05-29PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
#28 | 2025-05-08PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
#29 | 2025-05-08PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
#30 | 2025-05-08SUBSTRATE HAVING SIDEWALL PROTECTION LAYER AND MANUFACTURING METHOD THEREOF
#31 | 2025-05-01PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
#32 | 2025-05-01PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
#33 | 2025-04-17MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME
#34 | 2025-04-03PACKAGING SUBSTRATE, METHOD OF MANUFACTURING AN ELEMENT PACKAGE AND METHOD OF MANUFACTURING PACKAGING SUBSTRATE
#35 | 2025-03-27PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
#36 | 2025-03-27PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
#37 | 2025-03-27MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME
#38 | 2025-03-20PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
#39 | 2025-03-06METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE MANUFACTURED THEREBY
#40 | 2025-03-06SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
#41 | 2025-03-06METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE MANUFACTURED THEREBY
#42 | 2025-03-06PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#43 | 2025-03-06SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
#44 | 2024-12-05SUBSTRATE GRIPPER AND METHOD FOR MOVING A SUBSTRATE USING THE SAME
#45 | 2024-11-21SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME
#46 | 2024-10-10SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING THE SAME
#47 | 2024-07-02 ✅ Patent 12,027,454 granted on 2024-07-02Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
#48 | 2024-06-06SEMICONDUCTOR PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGES, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGING SUBSTRATE
#49 | 2024-05-23PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
#50 | 2024-05-23PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#51 | 2024-05-16Substrate and semiconductor module
#52 | 2024-04-18 ✅ Patent 12,288,742 granted on 2025-04-29Packaging substrate and semiconductor apparatus comprising same
#53 | 2024-03-21 ✅ Patent 12,506,040 granted on 2025-12-23PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE PREPARATION METHOD, AND SEMICONDUCTOR PACKAGE PREPARATION METHOD
#54 | 2024-02-15CORE-SUBSTRATE, SUBSTRATE AND USE OF SUBSTRATE FOR SEMICONDUCTOR PACKAGING
#55 | 2024-01-18DEVICE PACKAGING SUBSTRATE, MANUFACTURING METHOD FOR THE SAME, AND DEVICE PACKAGE COMPRISING THE SAME
#56 | 2024-01-18VIA CONNECTION STRUCTURE COMPRISING MULTIPLE VIAS AND SUBSTRATE COMPRISING THE SAME
#57 | 2024-01-04 ✅ Patent 12,469,736 granted on 2025-11-11SUBSTRATE CARRIER AND SUBSTRATE ASSEMBLY COMPRISING THE SAME
#58 | 2023-12-21CLEANED PACKAGING SUBSTRATE AND CLEANED PACKAGING SUBSTRATE MANUFACTURING METHOD
#59 | 2023-09-28 ✅ Patent 12,456,653 granted on 2025-10-28PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
#60 | 2023-06-29 ✅ Patent 12,456,672 granted on 2025-10-28PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
#61 | 2023-01-26SUBSTRATE COMPRISING A LID STRUCTURE, PACKAGE SUBSTRATE COMPRISING THE SAME AND SEMICONDUCTOR DEVICE
#62 | 2022-11-03 ✅ Patent 11,728,259 granted on 2023-08-15Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
#63 | 2022-05-26PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
#64 | 2022-05-12 ✅ Patent 11,967,542 granted on 2024-04-23Packaging substrate, and semiconductor device comprising same
#65 | 2022-02-24 ✅ Patent 12,198,994 granted on 2025-01-14Packaging substrate and method for manufacturing same
#66 | 2022-02-17 ✅ Patent 11,652,039 granted on 2023-05-16Packaging substrate with core layer and cavity structure and semiconductor device comprising the same
#67 | 2022-02-17 ✅ Patent 11,981,501 granted on 2024-05-14Loading cassette for substrate including glass and substrate loading method to which same is applied
#68 | 2021-12-23 ✅ Patent 11,437,308 granted on 2022-09-06Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus
#69 | 2021-12-16 ✅ Patent 11,469,167 granted on 2022-10-11Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
#70 | 2021-12-09 ✅ Patent 12,165,979 granted on 2024-12-10Packaging substrate and semiconductor apparatus comprising same
Also check out ABSOLICS INC.'s (Covington, United States) applicant profile with 64 patent applications submitted.
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