KAGA, INC.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2026-01-01

Patent Grants:

Last grant date:

2019-12-03

Top Inventors for applications by KAGA, INC.

These are the the leading inventors for applications assigned to KAGA, INC.:

Shu MATSUURA 5 Ishikawa, Japan
Yousuke NAKAMURA 4 Ishikawa, Japan
Masaru SAKAMOTO 2 Ishikawa, Japan
Yuji TANAKA 2 Ishikawa, Japan

Masaaki NOZAKI 2 Ishikawa, Japan
Hidenori KONTANI 2 Ishikawa, Japan
Kazumasa FUJII 1 Ishikawa, Japan
Akio KOBAYASHI 1 Ishikawa, Japan

Masaaki Nozaki 1 Tokyo, Japan
Shuhei KANEKO 1 Ishikawa, Japan

Recent patent applications by KAGA, INC.

KAGA, INC. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-01-01

US20260001120A1

Performing operations; transporting

FIXED STRUCTURE, FIXING METHOD, AND FIXING DEVICE

#2 | 2025-08-21

US20250262684A1

Performing operations; transporting

DISSIMILAR METAL JOINED BODY, AND METHOD FOR JOINING DISSIMILAR METAL JOINED BODY

#3 | 2023-10-05

US20230320037A1

Electricity

HEATSINK, METHOD FOR MANUFACTURING HEATSINK, AND ELECTRONIC COMPONENT PACKAGE USING SAID HEATSINK

#4 | 2022-05-26

US20220167532A1

Electricity

HEAT SINK AND ELECTRONIC COMPONENT PACKAGE

#5 | 2019-10-31 ✅ Patent 10,499,537 granted on 2019-12-03

US20190335614A1

Electricity

Heat sink and electronic component package

AssigneeID:

324282 ⎘