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Assignee profile:

JETCOOL TECHNOLOGIES INC.

City:

Littleton, Massachusetts

Country:

United States

Published Applications:

22

Last publication date:

2026-03-26

Patent Grants:

13

Last grant date:

2025-09-30

Top Inventors for applications by JETCOOL TECHNOLOGIES INC.

These are the the leading inventors for applications assigned to JETCOOL TECHNOLOGIES INC.:

Recent patent applications by JETCOOL TECHNOLOGIES INC.

JETCOOL TECHNOLOGIES INC. based in Littleton, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-03-26
US20260089881A1
Electricity

Actively Cooled Heat-Dissipation Lids for Computer Processors and Processor Assemblies

 #2 | 2026-02-12
US20260047048A1
Electricity

Cooling Module With Improved Flow Balancing, Jet-Height Control, and Wash-Out Mitigation

 #3 | 2026-02-12
US20260047046A1
Electricity

Bleed-in Reservoir For Improved All-In-One (AIO) System Longevity and Performance

 #4 | 2025-10-16
US20250324541A1
Electricity

Internal Recirculation Cooling Module

 #5 | 2025-08-07
US20250254824A1
Electricity

Reservoir with Flow Tunnel for All-In-One Cooling Systems

 #6 | 2025-02-13
US20250056759A1
Electricity

Direct Contact Fluid Based Cooling Module

 #7 | 2025-01-23 ✅ Patent 12,432,878 granted on 2025-09-30
US20250031342A1
Electricity

Internal Recirculation Cooling Module

 #8 | 2024-07-11 ✅ Patent 12,563,707 granted on 2026-02-24
US20240237307A9
Electricity

Cooling Module With Integrated Pump for Immersion Cooling in Electronics

 #9 | 2024-06-20 ✅ Patent 12,324,126 granted on 2025-06-03
US20240206128A1
Electricity

Actively cooled heat-dissipation lids for computer processors and processor assemblies

 #10 | 2024-04-25
US20240138128A1
Electricity

Cooling Module With Integrated Pump for Immersion Cooling in Electronics

 #11 | 2024-03-14 ✅ Patent 12,289,871 granted on 2025-04-29
US20240090180A1
Electricity

High temperature electronic device thermal management system

 #12 | 2023-09-07 ✅ Patent 12,016,157 granted on 2024-06-18
US20230284421A1
Electricity

Actively cooled heat-dissipation lids for computer processors and assemblies

 #13 | 2023-09-07
US20230284416A1
Electricity

Ship-and-Install Electronics Assembly with Multifunctional Interface Chassis and Liquid-Fluid Heat Exchange

 #14 | 2023-05-18 ✅ Patent 12,289,861 granted on 2025-04-29
US20230156959A1
Electricity

Liquid-in-liquid cooling system for electronic components

 #15 | 2023-02-16 ✅ Patent 12,048,118 granted on 2024-07-23
US20230048500A1
Electricity

Flow-through, hot-spot-targeting immersion cooling assembly

 #16 | 2022-12-22
US20220408592A1
Electricity

Re-Entrant Flow Cold Plate

 #17 | 2022-10-20 ✅ Patent 11,844,193 granted on 2023-12-12
US20220338375A1
Electricity

Direct contact fluid based cooling module

 #18 | 2022-07-21 ✅ Patent 12,288,733 granted on 2025-04-29
US20220230937A1
Electricity

Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies

 #19 | 2022-03-17 ✅ Patent 11,963,341 granted on 2024-04-16
US20220087076A1
Electricity

High temperature electronic device thermal management system

 #20 | 2021-02-04 ✅ Patent 11,277,937 granted on 2022-03-15
US20210037676A1
Electricity

Re-entrant flow cold plate

 #21 | 2020-11-05 ✅ Patent 11,191,184 granted on 2021-11-30
US20200352053A1
Electricity

Direct contact fluid based cooling module

 #22 | 2020-10-29 ✅ Patent 12,100,643 granted on 2024-09-24
US20200343160A1
Electricity

Thermal management of electronics using co-located microjet nozzles and electronic elements

Also check out Jetcool Technologies Inc.'s (Littleton, United States) applicant profile with 19 patent applications submitted.

AssigneeID:

326303 ⎘