Bondcore ÖU

City:

Tallinn

Country:

Estonia

Published Applications:

Last publication date:

2022-08-04

Patent Grants:

Last grant date:

2024-12-03

Top Inventors for applications by Bondcore ÖU

These are the the leading inventors for applications assigned to Bondcore ÖU:

RONALD J. BATTY 1 Perth, Canada

Recent patent applications by Bondcore ÖU

Bondcore ÖU based in Tallinn, EE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-08-04 ✅ Patent 12,157,250 granted on 2024-12-03

US20220242007A1

Performing operations; transporting

Composite wood panels with corrugated cores and method of manufacturing same

Also check out Bondcore ÖU's (Tallinn, Estonia) applicant profile with 1 patent applications submitted.

AssigneeID:

326662 ⎘