Austin, Texas
United States
11
2025-09-18
7
2026-01-06
These are the the leading inventors for applications assigned to PulseForge Inc.:
PulseForge Inc. based in Austin, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
METHOD FOR ATTACHING AND DETACHING WAFERS DURING INTEGRATED CIRCUIT MANUFACTURING
#2 | 2024-11-21METHOD FOR CURING THERMOSETTING POLYMERS
#3 | 2024-11-21METHOD FOR CURING AND RELEASING THERMOSETTING POLYMERS ON A COATED GLASS SUBSTRATE
#4 | 2024-09-26 ✅ Patent 12,519,078 granted on 2026-01-06METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS
#5 | 2024-09-05 ✅ Patent 12,538,830 granted on 2026-01-27METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS
#6 | 2023-06-08 ✅ Patent 11,769,660 granted on 2023-09-26Method and apparatus for removing particles from the surface of a semiconductor wafer
#7 | 2023-06-08 ✅ Patent 11,688,600 granted on 2023-06-27Method and apparatus for removing particles from the surface of a semiconductor wafer
#8 | 2023-04-04 ✅ Patent 11,621,175 granted on 2023-04-04Method and apparatus for removing particles from the surface of a semiconductor wafer
#9 | 2022-09-29METHOD FOR ATTACHING AND DETACHING SUBSTRATES DURING INTEGRATED CIRCUIT MANUFACTURING
#10 | 2022-06-16 ✅ Patent 11,996,384 granted on 2024-05-28Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
#11 | 2021-02-04 ✅ Patent 11,647,594 granted on 2023-05-09Method for curing solder paste on a thermally fragile substrate
Also check out PulseForge Inc.'s (Austin, United States) applicant profile with 8 patent applications submitted.
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