Chungcheongnam-do
South Korea
23
2024-12-26
22
2026-03-24
These are the the leading inventors for applications assigned to TSE CO., LTD:
TSE CO., LTD based in Chungcheongnam-do, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
TEST APPARATUS FOR SEMICONDUCTOR PACKAGE
#2 | 2024-11-21 ✅ Patent 12,584,944 granted on 2026-03-24TEST SOCKET
#3 | 2024-05-09 ✅ Patent 12,429,519 granted on 2025-09-30TEST APPARATUS FOR IMAGE SENSOR PACKAGE
#4 | 2024-04-18 ✅ Patent 12,461,144 granted on 2025-11-04RUBBER SOCKET WITH BUILT-IN COMPONENT
#5 | 2024-03-21 ✅ Patent 12,644,908 granted on 2026-06-02TEST SOCKET
#6 | 2023-11-30 ✅ Patent 12,313,678 granted on 2025-05-27Test apparatus for a semiconductor package
#7 | 2023-11-30 ✅ Patent 12,169,219 granted on 2024-12-17Apparatus for testing a semiconductor package
#8 | 2023-11-16 ✅ Patent 12,210,038 granted on 2025-01-28Method of manufacturing a probe tip and a probe tip manufactured by the same
#9 | 2023-08-24 ✅ Patent 12,000,863 granted on 2024-06-04Probe pin having gripping structure
#10 | 2023-08-17 ✅ Patent 12,169,211 granted on 2024-12-17Vertical probe pin and a probe card having same
#11 | 2023-07-27 ✅ Patent 12,405,869 granted on 2025-09-02TEST APPARATUS FOR TESTING A MOBILE AP
#12 | 2023-05-11 ✅ Patent 12,598,707 granted on 2026-04-07METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME FINE VIA AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY THE SAME
#13 | 2023-03-02 ✅ Patent 11,994,554 granted on 2024-05-28Test apparatus for semiconductor package
#14 | 2023-03-02 ✅ Patent 11,940,484 granted on 2024-03-26Test apparatus for semiconductor package
#15 | 2022-12-01BATCH JOINING TYPE MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
#16 | 2022-12-01 ✅ Patent 12,108,544 granted on 2024-10-01Multi-layer printed circuit board made of different materials and manufacturing method thereof
#17 | 2022-03-31 ✅ Patent 11,506,705 granted on 2022-11-22Test socket and test apparatus having the same
#18 | 2022-02-24 ✅ Patent 11,573,248 granted on 2023-02-07Test socket and test apparatus having the same
#19 | 2022-01-06 ✅ Patent 11,763,959 granted on 2023-09-19Electroconductive particles and signal-transmitting connector having same
#20 | 2021-10-07 ✅ Patent 11,233,352 granted on 2022-01-25Electro-conductive part protecting member for signal transmission connector
#21 | 2021-09-30 ✅ Patent 11,131,707 granted on 2021-09-28Test socket and test apparatus having the same, manufacturing method for the test socket
#22 | 2021-09-30 ✅ Patent 11,609,244 granted on 2023-03-21Test apparatus for semiconductor package
#23 | 2021-09-23 ✅ Patent 11,199,577 granted on 2021-12-14Test socket and test apparatus having the same, manufacturing method for the test socket
Also check out TSE CO., LTD.'s (Chungcheongnam-do, South Korea) applicant profile with 23 patent applications submitted.
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