Goleta, California
United States
110
2021-07-01
79
2023-02-28
These are the the leading inventors for applications assigned to Innovative Micro Technology:
Innovative Micro Technology based in Goleta, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
MEMS dual substrate switch with magnetic actuation
#2 | 2021-03-18 ✅ Patent 11,309,837 granted on 2022-04-19Resonant filter using mm wave cavity
#3 | 2021-01-21MEMS MAGNETIC SWITCH WITH PERMEABLE FEATURES
#4 | 2021-01-21 ✅ Patent 11,305,982 granted on 2022-04-19Eight spring dual substrate MEMS plate switch and method of manufacture
#5 | 2020-12-10 ✅ Patent 11,258,425 granted on 2022-02-22Microfabricated notch filter
#6 | 2020-12-10 ✅ Patent 11,502,669 granted on 2022-11-15Subterahertz microfabricated spectrometer
#7 | 2019-12-19LOW COST WAFER BONDING METHOD
#8 | 2019-11-07CONTACT SURFACE FOR MEMS DEVICE
#9 | 2019-10-31SHIELDED DUAL SUBSTRATE MEMS PLATE SWITCH AND METHOD OF MANUFACTURE
#10 | 2019-10-03METHOD FOR ETCHING SHAPES INTO SILICON
#11 | 2019-07-18MICROFABRICATED DEVICE WITH PIEZOELECTRIC SUBSTRATE AND METHOD OF MANUFACTURE
#12 | 2019-06-06 ✅ Patent 10,826,153 granted on 2020-11-03Resonant filter using mm wave cavity
#13 | 2019-05-09SCANNING OPTICAL BEAM SOURCE
#14 | 2019-02-28 ✅ Patent 10,804,850 granted on 2020-10-13Gas sensor using mm wave cavity
#15 | 2019-02-28MEMS DUAL SUBSTRATE SWITCH WITH MAGNETIC ACTUATION
#16 | 2019-02-28GAS SENSOR USING VCSEL
#17 | 2019-02-28 ✅ Patent 10,955,336 granted on 2021-03-23Gas sensor comprising a rotatable Fabry-Perot multilayer etalon
#18 | 2018-11-22 ✅ Patent 10,302,871 granted on 2019-05-28Microfabricated fiber optic platform
#19 | 2018-10-11 ✅ Patent 10,291,332 granted on 2019-05-14Self-aligned silicon fiber optic connector
#20 | 2018-06-28MICROFABRICATED OPTICAL APPARATUS WITH FLEXIBLE ELECTRICAL CONNECTOR
#21 | 2018-06-14 ✅ Patent 10,050,409 granted on 2018-08-14Microfabricated optical apparatus with grounded metal layer
#22 | 2018-06-07BONDLINE FOR MM-WAVE APPLICATIONS
#23 | 2018-05-24 ✅ Patent 10,388,468 granted on 2019-08-20Contact material for MEMS devices
#24 | 2018-05-03RF INTERCONNECT
#25 | 2018-04-24 ✅ Patent 9,950,923 granted on 2018-04-24Method for making vias using a doped substrate
#26 | 2018-03-22MEMS DEVICE WITH OFFSET ELECTRODE
#27 | 2018-03-15CONTACT SURFACE FOR MEMS DEVICE
#28 | 2017-11-23 ✅ Patent 10,011,478 granted on 2018-07-03Thermocompression bonding with raised feature
#29 | 2017-10-05 ✅ Patent 10,017,381 granted on 2018-07-10Microfabricated pressure transducer
#30 | 2017-08-17MICROFABRICATED OPTICAL APPARATUS
#31 | 2017-08-03THROUGH SUBSTRATE VIAS USING SOLDER BUMPS
#32 | 2017-05-25MICROFABRICATED OPTICAL APPARATUS WITH INTEGRATED TURNING SURFACE
#33 | 2017-05-04MICROFABRICATED OPTICAL APPARATUS
#34 | 2017-03-02DEVICE WITH SEPARATION LIMITING STANDOFF
#35 | 2016-11-15 ✅ Patent 9,493,877 granted on 2016-11-15Etching technique for microfabrication substrates
#36 | 2016-10-20 ✅ Patent 9,533,877 granted on 2017-01-03Anodic bonding of dielectric substrates
#37 | 2016-09-15 ✅ Patent 9,953,787 granted on 2018-04-24Dual substrate electrostatic MEMS switch with multiple hinges and method of manufacture
#38 | 2016-05-05 ✅ Patent 9,608,731 granted on 2017-03-28Microfabricated optical apparatus
#39 | 2016-04-05 ✅ Patent 9,302,905 granted on 2016-04-05Method for forming a microfabricated structure
#40 | 2016-03-31 ✅ Patent 9,324,613 granted on 2016-04-26Method for forming through substrate vias with tethers
#41 | 2016-02-11 ✅ Patent 9,330,874 granted on 2016-05-03Solder bump sealing method and device
#42 | 2015-10-13 ✅ Patent 9,156,679 granted on 2015-10-13Method and device using silicon substrate to glass substrate anodic bonding
#43 | 2015-09-24 ✅ Patent 9,162,878 granted on 2015-10-20Wafer level hermetic bond using metal alloy with raised feature and wetting layer
#44 | 2015-07-02 ✅ Patent 9,388,037 granted on 2016-07-12Device using glass substrate anodic bonding
#45 | 2015-07-02 ✅ Patent 9,315,375 granted on 2016-04-19Method using glass substrate anodic bonding
#46 | 2015-03-12Method for forming through wafer vias
#47 | 2015-01-29 ✅ Patent 9,372,185 granted on 2016-06-21MEMS particle sorting actuator and method of manufacture
#48 | 2015-01-29 ✅ Patent 9,274,180 granted on 2016-03-01Microfabricated magnetic field transducer with flux guide
#49 | 2014-09-30 ✅ Patent 8,847,373 granted on 2014-09-30Exothermic activation for high vacuum packaging
#50 | 2013-08-08Wafer bonding chamber with dissimilar wafer temperatures
#51 | 2012-12-25 ✅ Patent 8,338,283 granted on 2012-12-25Method and apparatus for applying thin liquid coatings
#52 | 2012-12-20 ✅ Patent 8,736,081 granted on 2014-05-27Wafer level hermetic bond using metal alloy with keeper layer
#53 | 2012-11-29 ✅ Patent 8,608,700 granted on 2013-12-17Microfabicated electromagnetic actuator with push-pull motion
#54 | 2012-10-11 ✅ Patent 8,993,311 granted on 2015-03-31Multi-stage cartridge for MEMS particle storing system
#55 | 2012-07-26 ✅ Patent 8,822,207 granted on 2014-09-02Cartridge for MEMS particle sorting system
#56 | 2012-07-26 ✅ Patent 8,871,500 granted on 2014-10-28MEMS particle sorting actuator and method of manufacturing
#57 | 2012-06-28Removable/disposable apparatus for MEMS particle sorting device
#58 | 2012-05-31Deposition/bonding chamber for encapsulated microdevices and method of use
#59 | 2012-04-05 ✅ Patent 8,343,791 granted on 2013-01-01Plating process and apparatus for through wafer features
#60 | 2012-03-22 ✅ Patent 8,558,364 granted on 2013-10-15Inductive getter activation for high vacuum packaging
#61 | 2012-01-19 ✅ Patent 8,088,651 granted on 2012-01-03System and method for providing access to an encapsulated device
#62 | 2011-12-01 ✅ Patent 8,690,830 granted on 2014-04-08In-plane electromagnetic MEMS pump
#63 | 2011-10-13 ✅ Patent 8,541,735 granted on 2013-09-24Inlaid optical material and method of manufacture
#64 | 2011-06-30 ✅ Patent 8,264,307 granted on 2012-09-11Dual substrate MEMS plate switch and method of manufacture
#65 | 2011-06-02 ✅ Patent 8,466,760 granted on 2013-06-18Configurable power supply using MEMS switch
#66 | 2011-02-03 ✅ Patent 8,288,211 granted on 2012-10-16Wafer level hermetic bond using metal alloy with keeper layer
#67 | 2010-01-28 ✅ Patent 8,245,391 granted on 2012-08-21Method of manufacturing a hysteretic MEMS two-dimensional thermal device
#68 | 2010-01-07 ✅ Patent 7,960,208 granted on 2011-06-14Wafer level hermetic bond using metal alloy with raised feature
#69 | 2009-08-13 ✅ Patent 7,944,113 granted on 2011-05-17Hysteretic MEMS thermal device and method of manufacture
#70 | 2009-07-16 ✅ Patent 7,759,152 granted on 2010-07-20MEMS thermal actuator and method of manufacture
#71 | 2009-02-26 ✅ Patent 7,759,218 granted on 2010-07-20Indented lid for encapsulated devices and method of manufacture
#72 | 2009-01-22 ✅ Patent 7,713,786 granted on 2010-05-11Etching/bonding chamber for encapsulated devices and method of use
#73 | 2009-01-01Gettering material for encapsulated microdevices and method of manufacture
#74 | 2008-12-25Wafer level hermetic bond using metal alloy
#75 | 2008-11-13 ✅ Patent 7,893,798 granted on 2011-02-22Dual substrate MEMS plate switch and method of manufacture
#76 | 2008-11-13 ✅ Patent 7,968,986 granted on 2011-06-28Lid structure for microdevice and method of manufacture
#77 | 2008-11-13 ✅ Patent 7,864,006 granted on 2011-01-04MEMS plate switch and method of manufacture
#78 | 2008-10-16Micromechanical device with gold alloy contacts and method of manufacture
#79 | 2008-08-14 ✅ Patent 7,622,783 granted on 2009-11-24MEMS thermal actuator and method of manufacture
#80 | 2008-05-29 ✅ Patent 7,687,304 granted on 2010-03-30Current-driven device using NiMn alloy and method of manufacture
#81 | 2008-04-17 ✅ Patent 7,688,167 granted on 2010-03-30Contact electrode for microdevices and etch method of manufacture
#82 | 2008-04-03 ✅ Patent 7,675,162 granted on 2010-03-09Interconnect structure using through wafer vias and method of fabrication
#83 | 2008-03-13 ✅ Patent 7,724,121 granted on 2010-05-25Singly attached MEMS thermal device and method of manufacture
#84 | 2008-01-10System and method for forming through wafer vias using reverse pulse plating
#85 | 2007-12-27 ✅ Patent 7,972,683 granted on 2011-07-05Wafer bonding material with embedded conductive particles
#86 | 2007-11-22 ✅ Patent 7,550,778 granted on 2009-06-23System and method for providing access to an encapsulated device
#87 | 2007-11-15 ✅ Patent 7,462,931 granted on 2008-12-09Indented structure for encapsulated devices and method of manufacture
#88 | 2007-10-11 ✅ Patent 7,807,547 granted on 2010-10-05Wafer bonding material with embedded rigid particles
#89 | 2007-10-11 ✅ Patent 7,528,691 granted on 2009-05-05Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture
#90 | 2007-09-27 ✅ Patent 7,812,703 granted on 2010-10-12MEMS device using NiMn alloy and method of manufacture
#91 | 2007-09-20 ✅ Patent 7,872,432 granted on 2011-01-18MEMS thermal device with slideably engaged tether and method of manufacture
#92 | 2007-08-23 ✅ Patent 7,785,913 granted on 2010-08-31System and method for forming moveable features on a composite substrate
#93 | 2007-08-09 ✅ Patent 7,533,792 granted on 2009-05-19Elastic interface for wafer bonding apparatus
#94 | 2007-07-26 ✅ Patent 7,548,145 granted on 2009-06-16Hysteretic MEMS thermal device and method of manufacture
#95 | 2007-07-19 ✅ Patent 7,626,311 granted on 2009-12-01Hysteretic MEMS two-dimensional thermal device and method of manufacture
#96 | 2007-05-03Compact MEMS thermal device and method of manufacture
#97 | 2007-03-15 ✅ Patent 7,276,991 granted on 2007-10-02Multiple switch MEMS structure and method of manufacture
#98 | 2007-03-01 ✅ Patent 7,569,926 granted on 2009-08-04Wafer level hermetic bond using metal alloy with raised feature
#99 | 2007-03-01Wafer level hermetic bond using metal alloy
#100 | 2007-03-01 ✅ Patent 7,233,048 granted on 2007-06-19MEMS device trench plating process and apparatus for through hole vias
Also check out Innovative Micro Technology's (Goleta, United States) applicant profile with 27 patent applications submitted.
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