ING CO., LTD.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2023-06-22

Patent Grants:

Last grant date:

2021-05-25

Top Inventors for applications by ING CO., LTD.

These are the the leading inventors for applications assigned to ING CO., LTD.:

Tomoko MORII 1 Osaka, Japan
Tomoko MORII 1 Osaka-shi Osaka, Japan
Masao SHIOMI 1 Osaka, Japan
Masamitsu AIBA 1 Osaka, Japan

Masamitsu AIBA 1 Osaka-shi Osaka, Japan
JUNSUKE TAKADA 1 OSAKA, Japan
Akiko TSUCHIYA 1 Osaka, Japan

Recent patent applications by ING CO., LTD.

ING CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-06-22

US20230192451A1

Performing operations; transporting

LIFTING CLAMP

#2 | 2019-03-28 ✅ Patent 11,014,393 granted on 2021-05-25

US20190092064A1

Performing operations; transporting

Image transfer sheet, manufacturing method for image transfer sheet, and image transfer method

Also check out ING CO., LTD.'s (Osaka, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

338489 ⎘