BOND TECHNOLOGIES, INC.

City:

ELKHART, Indiana

Country:

United States

Published Applications:

Last publication date:

2026-01-15

Patent Grants:

Last grant date:

2025-12-23

Top Inventors for applications by BOND TECHNOLOGIES, INC.

These are the the leading inventors for applications assigned to BOND TECHNOLOGIES, INC.:

TIMOTHY JOHN HAYNIE 2 UNION, MI United States
John Andrew Bosker 2 South Bend, IN United States
Arnold David Wright 1 Edwardsburg, MI United States
Arnold David Wright 1 Elkhart, IN United States

Kendall James McKenzie 1 Granger, IN United States
Timothy Wayne Wagler 1 South Bend, IN United States
John A. Bosker 1 South Bend, IN United States

Recent patent applications by BOND TECHNOLOGIES, INC.

BOND TECHNOLOGIES, INC. based in ELKHART, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-01-15

US20260014642A1

Performing operations; transporting

DEPTH CONTROL OF FRICTION STIR WELDING

#2 | 2025-12-23 ✅ Patent 12,502,726 granted on 2025-12-23

US18917546

Performing operations; transporting

Continuous rod feed for additive friction stir deposition

#3 | 2023-11-09 ✅ Patent 12,290,873 granted on 2025-05-06

US20230356322A1

Performing operations; transporting

Friction stir additive method and machine

Also check out BOND TECHNOLOGIES, INC.'s (Elkhart, United States) applicant profile with 3 patent applications submitted.

AssigneeID:

343547 ⎘