Ping-Jung Yang

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2024-04-11

Patent Grants:

Last grant date:

2024-08-13

Top Inventors for applications by Ping-Jung Yang

These are the the leading inventors for applications assigned to Ping-Jung Yang:

Ping-Jung Yang 6 HsinChu City, Taiwan
Ping-Jung Yang 5 Hsinchu, Taiwan
Ping-Jung Yang 5 Hsin-Chu City, Taiwan
Ping-Jung Yang 4 Hsin-Chu, Taiwan

Ping-Jung Yang 1 , United States

Recent patent applications by Ping-Jung Yang

Ping-Jung Yang based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-04-11 ✅ Patent 12,062,618 granted on 2024-08-13

US20240120281A1

Electricity

Chip package

#2 | 2023-03-09 ✅ Patent 11,894,306 granted on 2024-02-06

US20230073104A1

Electricity

Chip package

#3 | 2021-10-28 ✅ Patent 11,538,763 granted on 2022-12-27

US20210335714A1

Electricity

Chip package

#4 | 2020-05-21 ✅ Patent 11,107,768 granted on 2021-08-31

US20200161245A1

Electricity

Chip package

#5 | 2019-01-24 ✅ Patent 10,453,819 granted on 2019-10-22

US20190027459A1

Electricity

Method for fabricating glass substrate package

#6 | 2017-07-20 ✅ Patent 10,096,565 granted on 2018-10-09

US20170207188A1

Electricity

Method for fabricating glass substrate package

#7 | 2014-03-27 ✅ Patent 9,615,453 granted on 2017-04-04

US20140085842A1

Electricity

Method for fabricating glass substrate package

Also check out Ping-Jung Yang's (Hsinchu, Taiwan) applicant profile with 5 patent applications submitted.

AssigneeID:

353123 ⎘