Mine
Japan
9
2023-10-19
9
2026-04-28
These are the the leading inventors for applications assigned to NGK ELECTRONICS DEVICES, INC.:
NGK ELECTRONICS DEVICES, INC. based in Mine, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
PACKAGE
#2 | 2022-10-27 ✅ Patent 11,854,934 granted on 2023-12-26Package with heat dissipating substrate
#3 | 2022-10-27 ✅ Patent 11,929,301 granted on 2024-03-12Package and electronic device
#4 | 2022-05-12 ✅ Patent 11,849,538 granted on 2023-12-19Composite wiring board, package, and electronic device
#5 | 2022-03-10 ✅ Patent 11,901,268 granted on 2024-02-13Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith
#6 | 2022-03-10 ✅ Patent 11,978,682 granted on 2024-05-07Package, and method for manufacturing power semiconductor module
#7 | 2021-12-30 ✅ Patent 12,209,313 granted on 2025-01-28Metal member and production method therefor
#8 | 2021-08-26 ✅ Patent 11,897,817 granted on 2024-02-13Ceramic sintered body and substrate for semiconductor device
#9 | 2020-07-02 ✅ Patent 11,178,762 granted on 2021-11-16Connection structure for wiring substrate and flexible substrate and package for housing electronic components
Also check out NGK Electronics Devices, Inc.'s (Mine, Japan) applicant profile with 9 patent applications submitted.
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