SHIMANE UNIVERSITY

City:

Shimane

Country:

Japan

Published Applications:

Last publication date:

2021-06-17

Patent Grants:

Last grant date:

2024-02-13

Top Inventors for applications by SHIMANE UNIVERSITY

These are the the leading inventors for applications assigned to SHIMANE UNIVERSITY:

Tsuyoshi Mihara 1 Sendai, Japan
Tsuyoshi MIHARA 1 Sendai-shi, Japan
Hiroshi Usuki 1 Matsue, Japan

Recent patent applications by SHIMANE UNIVERSITY

SHIMANE UNIVERSITY based in Shimane, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-06-17 ✅ Patent 11,898,990 granted on 2024-02-13

US20210181153A1

Physics

Bonding interface evaluation method and bonding interface evaluation device

#2 | 2008-06-17 ✅ Patent 7,387,477 granted on 2008-06-17

US10784306

Controlled atmosphere cutting method using oxygen enrichment and cutting tool

AssigneeID:

353679 ⎘