Assignee profile:

GaN Systems Inc.

City:

Kanata

Country:

Canada

Published Applications:

13

Last publication date:

2024-09-12

Patent Grants:

13

Last grant date:

2025-06-17

Top Inventors for applications by GaN Systems Inc.

These are the the leading inventors for applications assigned to GaN Systems Inc.:

Recent patent applications by GaN Systems Inc.

GaN Systems Inc. based in Kanata, CA has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-09-12 ✅ Patent 12,336,148 granted on 2025-06-17
US20240306348A1
Electricity

THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED POWER SEMICONDUCTOR SWITCHING DEVICES

#2 | 2023-06-22 ✅ Patent 12,107,416 granted on 2024-10-01
US20230198252A1
Electricity

Integrated bidirectional ESD protection circuit for power semiconductor switching devices

#3 | 2022-09-22 ✅ Patent 11,463,012 granted on 2022-10-04
US20220302846A1
Electricity

Architecture for multi-port AC/DC switching mode power supply

#4 | 2022-08-04 ✅ Patent 11,776,883 granted on 2023-10-03
US20220246503A1
Electricity

Embedded die packaging for power semiconductor devices

#5 | 2022-06-30 ✅ Patent 11,545,889 granted on 2023-01-03
US20220209650A1
Electricity

Deadtime optimization for GaN half-bridge and full-bridge switch topologies

#6 | 2022-06-16 ✅ Patent 11,677,396 granted on 2023-06-13
US20220190825A1
Electricity

Hybrid power stage and gate driver circuit

#7 | 2022-05-05 ✅ Patent 11,515,235 granted on 2022-11-29
US20220139810A1
Electricity

Device topology for lateral power transistors with low common source inductance

#8 | 2022-05-05 ✅ Patent 11,527,460 granted on 2022-12-13
US20220139809A1
Electricity

Device topologies for high current lateral power semiconductor devices

#9 | 2022-04-14 ✅ Patent 11,476,188 granted on 2022-10-18
US20220115319A1
Electricity

Fabrication of embedded die packaging comprising laser drilled vias

#10 | 2022-01-20 ✅ Patent 11,342,248 granted on 2022-05-24
US20220020669A1
Electricity

Embedded die packaging for power semiconductor devices

#11 | 2021-07-29 ✅ Patent 11,431,261 granted on 2022-08-30
US20210234471A1
Electricity

Hybrid bulk capacitance circuit for AC input AC/DC switching mode power supplies

#12 | 2021-06-17 ✅ Patent 11,374,489 granted on 2022-06-28
US20210184567A1
Electricity

Hybrid bulk capacitance circuit for AC/DC charger

#13 | 2021-01-21 ✅ Patent 11,676,899 granted on 2023-06-13
US20210020573A1
Electricity

Embedded packaging for high voltage, high temperature operation of power semiconductor devices

Also check out GaN Systems Inc.'s (Kanata, Canada) applicant profile with 12 patent applications submitted.

AssigneeID:

354575 ⎘