HD MICROSYSTEMS, LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2022-09-01

Patent Grants:

Last grant date:

2025-08-12

Top Inventors for applications by HD MICROSYSTEMS, LTD.

These are the the leading inventors for applications assigned to HD MICROSYSTEMS, LTD.:

Tetsuya ENOMOTO 3 Hitachi-shi, lbaraki, Japan
Tadamitsu Nakamura 3 Hitachi, Japan
Tadamitsu NAKAMURA 3 Hitachi-shi, lbaraki, Japan
Tetsuya Enomoto 3 Hitachi, Japan

Nobuyuki Saito 3 Hitachi, Japan
Nobuyuki SAITO 2 Hitachi-shi, lbaraki, Japan
Atsutaro Yoshizawa 2 Hitachi, Japan
Satoshi Yoneda 2 Hitachi, Japan

Akira ASADA 2 Hitachi-shi, lbaraki, Japan
Tetsuya ENOMOTO 2 Tokyo, Japan
Daisaku MATSUKAWA 2 Tokyo, Japan
Yukari Koibuchi 2 Hitachi, Japan

Daisaku Matsukawa 2 Hitachi, Japan
Yukari KOIBUCHI 2 Hitachi-shi, lbaraki, Japan
Akira Asada 2 Hitachi, Japan
Noriyuki YAMAZAKI 1 Hitachi-shi, lbaraki, Japan

Kazuya SOEJIMA 1 Hitachi-shi, lbaraki, Japan
Yutaka NAMATAME 1 Hitachi-shi, lbaraki, Japan
Shingo Tahara 1 Hitachi-shi, Japan
Etsuharu TSUCHIYA 1 Chiyoda-ku, Tokyo, Japan

Daisaku MATSUKAWA 1 Chiyoda-ku, Tokyo, Japan
Masayuki Ohe 1 Hitachi, Japan
Satoshi YONEDA 1 Hitachi-shi, Ibaraki, Japan
Ayaka AZUMA 1 Hitachi-shi, lbaraki, Japan

Daisaku MATSUKAWA 1 Hitachi-shi, lbaraki, Japan
Masato NISHIMURA 1 Chiyoda-ku, Tokyo, Japan
Ayaka Azuma 1 Hitachi, Japan
Shingo Tahara 1 Hitachi, Japan

Hiroko YOTSUYANAGI 1 Hitachi-shi, Ibaraki, Japan
Atsutaro YOSHIZAWA 1 Hitachi-shi, lbaraki, Japan
Satoshi YONEDA 1 Hitachi-shi, lbaraki, Japan
Noriyuki Yamazaki 1 Hitachi, Japan

Satoshi Abe 1 Hitachi, Japan
Masayuki OHE 1 Hitachi-shi, lbaraki, Japan
Atsutaro YOSHIZAWA 1 Hitachi-shi, Ibaraki, Japan
Takashi KAWAMORI 1 Chiyoda-ku, Tokyo, Japan

Satoshi ABE 1 Hitachi-shi, lbaraki, Japan
Yutaka Namatame 1 Hitachi, Japan
Takashi KAWAMORI 1 Tokyo, Japan
Etsuharu Tsuchiya 1 Tokyo, Japan

Kazuya Soejima 1 Hitachi, Japan
Daisaku Matsukawa 1 Hitachi-shi, Japan
Hiroko Yotsuyanagi 1 Hitachi, Japan
Masato NISHIMURA 1 Tokyo, Japan

Nobuyuki Saito 1 Hitachi-shi, Japan

Recent patent applications by HD MICROSYSTEMS, LTD.

HD MICROSYSTEMS, LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-09-01 ✅ Patent 12,386,257 granted on 2025-08-12

US20220276555A1

Physics

Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component

#2 | 2021-12-09 ✅ Patent 12,601,970 granted on 2026-04-14

US20210382391A1

Physics

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

#3 | 2021-10-07 ✅ Patent 12,386,256 granted on 2025-08-12

US20210311390A1

Physics

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

#4 | 2021-04-22 ✅ Patent 11,487,201 granted on 2022-11-01

US20210116809A1

Physics

Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component

#5 | 2021-01-21 ✅ Patent 11,807,721 granted on 2023-11-07

US20210018837A1

Physics

Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component

#6 | 2020-02-06 ✅ Patent 11,226,560 granted on 2022-01-18

US20200041900A1

Physics

Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component

#7 | 2019-05-30 ✅ Patent 11,021,572 granted on 2021-06-01