Optopac, Inc.

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

Last publication date:

2007-01-11

Patent Grants:

Last grant date:

2009-02-24

Top Inventors for applications by Optopac, Inc.

These are the the leading inventors for applications assigned to Optopac, Inc.:

Deok Hoon Kim 2 Tempe, AZ United States
Deok-Hoon Kim 2 AnYang-Si, South Korea
Deok-Hoon Kim 1 Suweon, South Korea

Recent patent applications by Optopac, Inc.

Optopac, Inc. based in Gyeonggi-do, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-01-11 ✅ Patent 7,494,848 granted on 2009-02-24

US20070007667A1

Electricity

Flip-chip packaging of a photo-sensor die on a transparent substrate

#2 | 2005-10-13 ✅ Patent 7,122,874 granted on 2006-10-17

US20050224938A1

Electricity

Electronic package having a sealing structure on predetermined area, and the method thereof

#3 | 2005-09-22 ✅ Patent 7,291,518 granted on 2007-11-06

US20050208702A1

Electricity

Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof

#4 | 2005-09-13 ✅ Patent 6,943,424 granted on 2005-09-13

US10885654

Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof

#5 | 2005-04-07 ✅ Patent 6,943,423 granted on 2005-09-13

US20050073017A1

Electricity

Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof

AssigneeID:

361162 ⎘