Sapporo Electroplating Industrial, Co., Ltd.

City:

Sapporo

Country:

Japan

Published Applications:

Last publication date:

2005-08-04

Patent Grants:

Last grant date:

2006-02-14

Top Inventors for applications by Sapporo Electroplating Industrial, Co., Ltd.

These are the the leading inventors for applications assigned to Sapporo Electroplating Industrial, Co., Ltd.:

Takayuki Yoshioka 2 Kanagawa, Japan
Hiroshi Yakuwa 2 Kanagawa, Japan
Shigenari Hayashi 2 Hokkaido, Japan
Toshio Narita 2 Hokkaido, Japan

Michiaki Souma 2 Hokkaido, Japan

Recent patent applications by Sapporo Electroplating Industrial, Co., Ltd.

Sapporo Electroplating Industrial, Co., Ltd. based in Sapporo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2005-08-04 ✅ Patent 6,998,035 granted on 2006-02-14

US20050167282A1

Chemistry; metallurgy

Method for forming Re-Cr alloy film through electroplating process using bath containing Cr(VI)

#2 | 2005-06-16 ✅ Patent 6,979,392 granted on 2005-12-27

US20050126922A1

Chemistry; metallurgy

Method for forming Re—Cr alloy film or Re-based film through electroplating process

AssigneeID:

362043 ⎘