Hong Kong
9
2011-07-12
9
2011-07-12
These are the the leading inventors for applications assigned to ASM Assembly Automation Ltd.:
ASM Assembly Automation Ltd. based in , HK has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Die bonder incorporating dual-head dispenser
#2 | 2010-05-20 ✅ Patent 7,810,698 granted on 2010-10-12Vision system for positioning a bonding tool
#3 | 2007-06-14 ✅ Patent 7,726,540 granted on 2010-06-01Apparatus and method for arranging devices for processing
#4 | 2006-08-08 ✅ Patent 7,087,202 granted on 2006-08-08Particulate reinforced aluminum composites, their components and the near net shape forming process of the components
#5 | 2006-01-31 ✅ Patent 6,991,825 granted on 2006-01-31Dispensation of controlled quantities of material onto a substrate
#6 | 2005-09-27 ✅ Patent 6,949,146 granted on 2005-09-27Ultrasonic cleaning module for singulated electronic packages
#7 | 2005-08-25 ✅ Patent 6,991,967 granted on 2006-01-31Apparatus and method for die attachment
#8 | 2005-05-03 ✅ Patent 6,886,997 granted on 2005-05-03Apparatus and method for active alignment of optical components
#9 | 2005-01-13 ✅ Patent 7,045,803 granted on 2006-05-16Missing die detection
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