Sunnyvale, California
United States
22
2007-11-08
22
2009-03-31
These are the the leading inventors for applications assigned to Tru-Si Technologies, Inc.:
Tru-Si Technologies, Inc. based in Sunnyvale, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
#2 | 2007-06-07 ✅ Patent 7,521,360 granted on 2009-04-21Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
#3 | 2007-02-20 ✅ Patent 7,179,397 granted on 2007-02-20Plasma processing methods and apparatus
#4 | 2006-12-05 ✅ Patent 7,144,056 granted on 2006-12-05Detection and handling of semiconductor wafers and wafers-like objects
#5 | 2006-09-12 ✅ Patent 7,104,579 granted on 2006-09-12Detection and handling of semiconductor wafers and wafer-like objects
#6 | 2006-04-11 ✅ Patent 7,027,894 granted on 2006-04-11Article holders with sensors detecting a type of article held by the holder
#7 | 2006-02-23 ✅ Patent 7,241,641 granted on 2007-07-10Attachment of integrated circuit structures and other substrates to substrates with vias
#8 | 2006-02-16 ✅ Patent 7,186,586 granted on 2007-03-06Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
#9 | 2005-10-25 ✅ Patent 6,958,285 granted on 2005-10-25Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings
#10 | 2005-09-27 ✅ Patent 6,948,898 granted on 2005-09-27Alignment of semiconductor wafers and other articles
#11 | 2005-09-22 ✅ Patent 7,173,327 granted on 2007-02-06Clock distribution networks and conductive lines in semiconductor integrated circuits
#12 | 2005-09-01 ✅ Patent 7,034,401 granted on 2006-04-25Packaging substrates for integrated circuits and soldering methods
#13 | 2005-08-30 ✅ Patent 6,935,830 granted on 2005-08-30Alignment of semiconductor wafers and other articles
#14 | 2005-06-23 ✅ Patent 7,241,675 granted on 2007-07-10Attachment of integrated circuit structures and other substrates to substrates with vias
#15 | 2005-06-23 ✅ Patent 7,049,170 granted on 2006-05-23Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
#16 | 2005-06-23 ✅ Patent 7,060,601 granted on 2006-06-13Packaging substrates for integrated circuits and soldering methods
#17 | 2005-05-31 ✅ Patent 6,899,788 granted on 2005-05-31Article holders that use gas vortices to hold an article in a desired position
#18 | 2005-05-24 ✅ Patent 6,897,148 granted on 2005-05-24Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
#19 | 2005-05-19 ✅ Patent 7,001,825 granted on 2006-02-21Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
#20 | 2005-04-19 ✅ Patent 6,882,030 granted on 2005-04-19Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate
#21 | 2005-01-18 ✅ Patent 6,844,241 granted on 2005-01-18Fabrication of semiconductor structures having multiple conductive layers in an opening
#22 | 2005-01-06 ✅ Patent 7,052,229 granted on 2006-05-30Alignment of semiconductor wafers and other articles
362657 ⎘