Taiwan
15
2008-01-31
15
2010-04-27
These are the the leading inventors for applications assigned to Phoenix Precision Technology Corporation:
Phoenix Precision Technology Corporation based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Package structure having semiconductor chip embedded therein and method for fabricating the same
#2 | 2007-12-06 ✅ Patent 7,419,897 granted on 2008-09-02Method of fabricating circuit board having different electrical connection structures
#3 | 2006-05-09 ✅ Patent 7,041,591 granted on 2006-05-09Method for fabricating semiconductor package substrate with plated metal layer over conductive pad
#4 | 2006-05-04 ✅ Patent 7,323,762 granted on 2008-01-29Semiconductor package substrate with embedded resistors and method for fabricating the same
#5 | 2006-05-04 ✅ Patent 7,174,630 granted on 2007-02-13Method for fabricating connection terminal of circuit board
#6 | 2006-04-13 ✅ Patent 7,151,050 granted on 2006-12-19Method for fabricating electrical connection structure of circuit board
#7 | 2006-03-09 ✅ Patent 7,129,117 granted on 2006-10-31Method of embedding semiconductor chip in support plate and embedded structure thereof
#8 | 2005-12-29 ✅ Patent 7,033,862 granted on 2006-04-25Method of embedding semiconductor element in carrier and embedded structure thereof
#9 | 2005-12-29 ✅ Patent 7,089,660 granted on 2006-08-15Method of fabricating a circuit board
#10 | 2005-10-27 ✅ Patent 7,365,272 granted on 2008-04-29Circuit board with identifiable information and method for fabricating the same
#11 | 2005-10-13 ✅ Patent 7,174,631 granted on 2007-02-13Method of fabricating electrical connection terminal of embedded chip
#12 | 2005-04-21 ✅ Patent 7,012,019 granted on 2006-03-14Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same
#13 | 2005-03-31 ✅ Patent 7,112,524 granted on 2006-09-26Substrate for pre-soldering material and fabrication method thereof
#14 | 2005-03-03 ✅ Patent 7,050,304 granted on 2006-05-23Heat sink structure with embedded electronic components for semiconductor package
#15 | 2005-01-04 ✅ Patent 6,838,314 granted on 2005-01-04Substrate with stacked vias and fine circuits thereon, and method for fabricating the same
362997 ⎘